Papers by Keyword: Czochralski Silicon

Abstract: Effects of prior rapid thermal processing (RTP) under different atmospheres on the motion of dislocations initiated from indentations in Czochralski (CZ) silicon have been investigated. It is found that the maximum gliding distances of dislocations in the specimens with the prior RTP under nitrogen (N₂) atmosphere are much smaller than those in the specimens with the prior RTP under argon (Ar) atmosphere. This is also the case when the specimens received annealing for oxygen precipitation (OP) subsequent to the RTP at 1250 °C under N₂ and Ar atmospheres, respectively. It is believed that the nitrogen atoms introduced during the RTP under nitrogen atmosphere or the oxygen precipitates facilitated by the RTP-introduced nitrogen atoms can exhibit pinning effect on the dislocation motion, which increases the critical resolved shear stress for dislocation glide.

Abstract: Oxygen precipitation (OP) and annihilation of voids in heavily phosphorus (P)-doped Czochralski (Cz) silicon have been investigated. It was found that the nucleation anneal at 650°C resulted in much more pronounced OP in the subsequent high temperature anneal than that at 800 or 900 °C. This was due to that SiP precipitates could be formed in heavily P-doped Cz silicon by the 650oC anneal and they acted as the heterogeneous nuclei for OP in the following anneal at high temperatures. The rapid thermal anneal (RTA) at 1200°C was proved to be an effective means to annihilate voids. Moreover, it was found that the significant OP resulting from the two-step anneal of 650°C/8 h + 1000°C/16 h could also cause the substantial annihilation of voids in heavily P-doped Cz silicon. The mechanisms for the annihilation of voids have been tentatively discussed.

Abstract: Oxygen precipitation (OP) behaviors were investigated for Czochralski (Cz) silicon wafers, which were coated with silicon nitride (SiNx) films or not, subjected to two-step anneal of 800C/4 h+1000°C/16 h following rapid thermal processing (RTP) at different temperatures ranging from 1150 to 1250C for 50 s. It was found that OP in the Cz silicon wafers coated with SiNx films was stronger in each case. This was because that nitrogen atoms diffused into bulk of Cz silicon wafer from the surface coated SiNx film during the high temperature RTP. Furthermore, it was proved that the RTP lamp irradiation facilitated the in-diffusion of nitrogen atoms, which was most likely due to that the ultraviolet light enhanced the breakage of silicon-nitrogen bonds.

Abstract: Results are presented of a comparative study of diodes processed on n-type Cz grown Si substrates without and with Ge doping concentration of about 10¹⁹ cm^-3 and 10²⁰ cm^-3. In order to investigate thermal donor formation, isothermal annealing at 450°C for 0.5 – 5 h was carried out. As processed diodes were also irradiated with 2 MeV electrons with fluences in the range between 10¹⁴ and 10¹⁷ e/cm² to investigate the Ge doping influence on irradiation induced defect formation. Diodes after thermal and radiation treatments have been investigated by combining different techniques.

Abstract: We report on study of oxygen precipitates grown in Czochralski silicon wafers investigated by x-ray diffraction in Bragg reflection geometry and Laue transmission geometry. The analysis of diffraction curves in Laue geometry was done using Takagi equations and statistical dynamical theory of diffraction. These techniques allow us to determine as the radius of defect area as the defect concentrations from measurement in Laue geometry. These results obtained on silicon wafers exposed to two-step and three-step treatments were compared with other experimental techniques including transmission electron microscopy and infrared absorption spectroscopy, while only the largest precipitates are detected by other techniques. The results of all methods are in good agreement.

Abstract: Oxygen precipitation (OP) behaviors in conventional and nitrogen co-doped heavily arsenic-doped Czocharalski silicon crystals subjected to low-high two-step anneals of 650 oC/8 h + 1000 oC/4-256 h have been comparatively investigated. Due to the nitrogen enhanced nucleation of OP during the low temperature anneal, much higher density of oxygen precipitates generated in the nitrogen co-doped specimens. With the extension of high temperature anneal, Oswald ripening of OP in the nitrogen co-doped specimens preceded that in the conventional ones. Moreover, due to the Oswald ripening effect, the oxygen precipitates in the conventional specimens became larger with a wider range of sizes. While, the sizes of oxygen precipitates in the nitrogen co-doped specimens distributed in a much narrower range with respect to the conventional ones.

Abstract: The novel concept of “impurity engineering in CZochralski (CZ) silicon ” for large scaled integrated circuits has been reviewed. By doping with a certain impurities into CZ silicon materials intentionally, such as nitrogen (N), germanium (Ge) and even carbon (C, with high concentration), internal gettering ability of CZ silicon wafers could be improved. Meanwhile, void defects in CZ silicon wafer could be easily eliminated during annealing at higher temperatures. Furthermore, it was also found that the mechanical strength could be increased, so that breakage of wafers decreased. Thus, it is believed that by impurity engineering CZ silicon wafers can satisfy the requirment of ultra large scale integrated circuits.

Abstract: The objective of this paper is to give an overview on how silicon particle detector would survive operational in extremely harsh radiation environment after luminosity upgrade of the CERN LHC (Large Hadron Collider). The Super-LHC would result in an integrated fluence 1×1016 p/cm2 and that is well beyond the radiation tolerance of even the most advanced semiconductor detectors fabricated by commonly adopted technologies. The Czochralski silicon (Cz-Si) has intrinsically high oxygen concentration. Therefore Cz-Si is considered as a promising material for the tracking systems in future very high luminosity colliders. The fabrication process issues of Cz-Si are discussed and the formation of thermal donors is especially emphasized. N+/p-/p+ and p+/n-/n+ detectors have been processed on magnetic Czochralski (MCz-Si) wafers. We show measurement data of AC-coupled strip detectors and single pad detectors as well as experimental results of intentional TD doping. Data of spatial homogeneity of electrical properties, full depletion voltage and leakage current, is shown and n and p-type devices are compared. Our results show that it is possible to manufacture high quality n+/p-/p+ and p+/n-/n+ particle detectors from high resistivity Czochralski silicon.

Abstract: Segmented silicon detectors are widely used in modern high-energy physics (HEP) experiments due to their excellent spatial resolution and well-established manufacturing technology. However, in such experiments the detectors are exposed to high fluences of particle radiation, which causes irreversible crystallographic defects in the silicon material. Since 1990’s, considerable amount of research has gone into improving the radiation hardness of silicon detectors. One very promising approach is to use magnetic Czochralski silicon (MCz-Si) that has been found to be more radiation hard against charged hadrons than traditional Float Zone silicon material (Fz-Si) used in the current HEP applications. Other approaches include operating the devices at cryogenic temperatures and designing special detector structures such as p-type detectors or semi-3D detectors. In order to demonstrate that the developed technologies are suitable for the HEP experiments, it is necessary to extensively characterize the potentially radiation hard detectors. We have an excellent instrument for this, the Cryogenic Transient Current Technique (C-TCT) measurement setup, which is an effective research tool for studying heavily irradiated silicon detectors. With the C-TCT setup it is possible to extract the full depletion voltage, effective trapping time, electric field distribution and the sign of the space charge in the silicon bulk in the temperature range of 45-300 K. This article

Abstract: The thermal donor formation at 425oC - 450oC in Ge doped Czochralski (GCZ) silicon having about 1016 cm-3 Ge content pretreated by rapid thermal annealing (RTA) and conventional furnace annealing (CFA) has been investigated using low-temperature infrared spectroscopy (LT-IR). The measurements prove that lightly Ge doping can enhance the formation of thermal double donors in the initial stage of the low temperature annealing after RTA process. Ge induced additional grown-in oxygen precipitates during silicon ingot growth and the abundant self-interstitials during RTA may be the reason for the enhancement. However, after extending the annealing time at the low temperatures, the thermal donor concentration in the GCZ silicon is lower than that in the conventional CZ silicon. In final, the mechanism is also discussed.