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Articles by keyword: «Flip Chip»

• Analysis of Stress Distribution in SnAgCu Solder Joint
  Published in: Modern Practice in Stress and Vibration Analysis VI (p359)
• Bump Formation and Flip Chip Processes for RF System-on-Packages
  Published in: Advances in Nanomaterials and Processing (p25)
• Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly
  Published in: Manufacturing Process Technology (p3466)
• Failure Mechanism of Electromigration in Solder Joint
  Published in: Materials and Product Technologies (p905)
• Failure of Flip-Chip Circuit Interconnects under High Current Density
  Published in: Materials and Product Technologies II (p449)
• Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging
  Published in: Eco-Materials Processing & Design VI (p273)
• Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows
  Published in: THERMEC 2006 Supplement (p181)
• Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps
  Published in: Eco-Materials Processing & Design VII (p550)
• Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM
  Published in: Advances in Fracture and Strength (p863)
• Modal Analysis of Flip Chip for Solder Bump Defect Detection
  Published in: Automation Equipment and Systems (p2104)
• Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints
  Published in: Manufacturing Science and Engineering I (p3963)
• Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
  Published in: Eco-Materials Processing and Design VIII (p621)
• Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test
  Published in: Advances in Nanomaterials and Processing (p5)
• The Characterization of Electroless Ni Bump for the Flip Chip
  Published in: Metastable, Mechanically Alloyed and Nanocrystalline Materials 2002 (p439)
• Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging
  Published in: Fracture and Strength of Solids VI (p1049)