Papers by Keyword: Hard-Brittle Material

Abstract: With the rapid development of modern optics and correlative science and technology, hard-brittle materials such as optical glass, optical crystal and glass ceramic have very important applications in the fields of military, space and aviation, electronics and so on. It is of great importance to research optical machining method for hard-brittle materials for the development of science and technology. Different kinds of ultra precision machining methods have been developed to meet different industry requirement. Such as chemical mechanical polishing, precession polishing and magnetorheological finishing, etc. Under most conditions the optical surface after ultra precision machining would have certain contaminant particles and this would affect its working ability in future use. Formerly the polished workpiece is cleaned by flowing water or ultrasonic cleaning and the contaminant particles couldn’t be totally removed. Laser cleaning is brought forward in this paper and good results could be anticipated.

Abstract: A better understanding of the hard-brittle material removal mechanism in wire-sawing provides a basis for optimizing the wire-saw and processing parameters. The maximum cutting depth of each diamond grain in wire-sawing is given. It is proved theoretically that the deformation mode on the machined hard-brittle material surface gradually shifts from brittle fracture to ductile deformation with the increasing of wire-saw velocity, the decreasing of infeed velocity and the decreasing of average grain size. The experimental investigation on the wire-sawing of granite is carried out. It is shown that in the case of wire-saw velocity of 20m/s, infeed velocity of 0.15mm/s and diamond grain size of 200~230#, the removal mechanism in wire-sawing is ductile mode.