Papers by Keyword: Laser Doping

Abstract: N atoms were doped into SiN_x/4H-SiC substrates by KrF laser irradiation while the substrates were heated. The diffusion depth of nitrogen increased above the solubility limit when the sample heated to 600°C was irradiated by the laser compared to the sample at room temperature. In addition, a clear 4H-SiC pattern was observed in the cross-sectional TEM diffraction image, thereby suggesting that sufficient crystal recovery was achieved even under melt-solidification conditions owing to the effect of substrate heating.

Abstract: In this study, machine learning (ML) was employed to predict the electrical properties of finished devices, specifically focusing on the state of the contacts at the electrodes. The predictions are based on optical microscope images of the surface conditions, which were captured immediately following the laser doping of nitrogen atoms into 4H-SiC. The laser doping process involved varying the laser fluence from 0.4 to 4.0 J/cm² and using number of laser irradiation to 5, 10, 20, and 100 shots. The ML prediction was carried out in two steps. In STEP1, we classified the contact status into three types.: 1) Schottky junctions (insufficient doping), 2) Ohmic contact (good contact), and 3) Not ohmic (damage caused by laser irradiation). In STEP2, contact resistance prediction (numerical regression) was performed using the dataset predicted as an ohmic contact. As a result, we found that the three classifications in STEP1 could be predicted with a high accuracy of over 88%. Furthermore, the contact resistance prediction in STEP2 could be made with an accuracy (RMSPE: root mean square percent error) of 27.2%. Visualizing the prediction basis of numerical regression using modulus-reweighted grad-regression activation mapping (MoRAM) revealed that the ML model focused on the inside of the laser-irradiated area in the optical microscope image. The results of the scanning electron microscopy observation of the laser-irradiated area showed that ablation and residuals were generated during laser doping in that area. Consequently, it was concluded that our ML model predicted the contact resistance of the finished device taking into consideration these surface conditions. Even highly-skilled laser doping technicians have difficulty predicting the resistance values arising from the ablation and residue conditions. Based on above results, we conclude that our ML model is capable of predicting the electrical characteristics of a finished device, a task that is often considered challenging for humans.

Abstract: Al doping into 4H-SiC performed by irradiating pulse-width-expanded excimer laser to an Al film deposited on the 4H-SiC surface is investigated. An optical pulse stretcher was constructed to produce the laser pulse whose peak intensity was reduced as half as that of the original pulse and pulse width was expanded from 55 ns to 100 ns. The irradiation of the expanded pulses is found to reduce the ablation of the materials from the surface and enable irradiation of multiple shots. As the result, doping depth of Al is significantly increased. The multiple shots of the expanded pulses is also fund to decrease the sensitivity to spatial non-uniformity of laser intensity and increase the uniformity of doped region.

Abstract: We report nitrogen (N) doping of 4H-SiC by KrF excimer laser irradiation in liquid N₂. In comparison to phosphorus (P) doping performed using phosphoric acid solution, the liquid-N₂ immersion-laser doping can introduce N atoms deeper (~ 1 μm depth) into the 4H-SiC, which results in reduction of doped layer resistance by approximately 3 orders of magnitude. Doping is shown to proceed by the thermal diffusion of species, while loss of the host material from the surface by ablation takes place at the same time. Chemical analysis shows that high density carbon (C) vacancies are generated in the N doped region, which suggests enhanced diffusion of N assisted by the presence of C vacancies. pn junction diodes are formed by using the N doping technique. Turn-on voltage is ~ -3V, which is reasonable for a pn junction diode of 4H-SiC.

Abstract: Silicon carbide (SiC) is a promising semiconductor for high-power devices due to its superior material properties; high breakdown field, high electron saturation velocity, and high thermal conductivity. To implement SiC power devices, pn junction must be formed in the SiC. However, ion implantation for impurity doping has several issues for the SiC. For example, while a high-temperature (~1700 °C) post-implantation annealing is required to electrically activate implanted species [, it induces generation of crystallographic defects in the SiC, such as segregation of carbon atoms at the surface from the SiC bulk [. Therefore, development of new technology for local doping of SiC is highly demanded.

Abstract: An uncooled SiC-based electro-optic device is developed for gas sensing applications. P-type dopants Ga, Sc, P and Al are incorporated into an n-type crystalline 6H-SiC substrate by a laser doping technique for sensing CO₂, CO, NO₂ and NO gases, respectively. Each dopant creates an acceptor energy level within the bandgap of the substrate so that the energy gap between this acceptor level and the valence band matches the quantum of energy emitted by the gas of interest. The photons of the gas excite electrons from the valence band to the acceptor level, which alters the electron density in these two states. Consequently, the refractive index of the substrate changes, which, in turn, modifies the reflectivity of the substrate. This change in reflectivity represents the optical signal of the sensor, which is probed remotely with a laser such as a helium-neon laser. Although the midwave infrared (3-5 mm) band is studied in this paper, the approach is applicable to other spectral bands.

Abstract: Chromium (Cr) and selenium (Se) are laser doped in silicon carbide (4H-SiC p-type aluminium) to fabricate an embedded light emitting device and to tune the light emission. A near infrared Nd:YAG (1064 nm wavelength) laser source and an organometallic Cr compound (bis (ethyl benzene)-chromium) and organometallic Se compound (dimethyl selenide) were used to laser dope SiC. A p-n junction device structure was created using these dopants. The dopant profiles have been characterized using secondary ion mass spectrometry. Electrical properties were measured using Hall effect measurement. Enhanced diffusivity and solubility with complete activation of dopants was observed for laser doped Cr and Se. Cr and Se are unconventional dopants, which serve as a double donor and a double acceptor respectively, while aluminium (Al) behaves as single acceptor and nitrogen (N) as a single donor in SiC. The defect levels (donor and acceptor) created within the forbidden band gap of SiC due to Se, Cr and Al onsets the donor acceptor pair (DAP) recombination mechanism for luminescence observed in SiC. Electroluminescence studies showed an orange (677 nm) corresponding to Cr-Al and, red (698 nm) and white (380-900 nm) for Se-Al and pure white for Cr-Se-Al. The Cr-Se-Al white light exhibited a correlated color temperature of 4935 K, which compares well to average daylight (5500 K).

Abstract: One of the most challenging problems to develop polycrystalline silicon thin-film solar cells is the growth of crystalline silicon on foreign, low-cost and low-temperature substrates. In this paper, a laser doping technique was developed for the plasma-deposited amorphous silicon film. A process combination of recrystallization and dopant diffusion (phosphorous or boron) was achieved simultaneously by the laser annealing process. The doping precursor was synthesized by a sol-gel method and was spin-coated on the sample. After laser irradiation, the grain size of the doped polycrystalline silicon was examined to be about 0.5~1.0 µm. The concentrations of 2×1019 and 5× 1018 cm-3 with Hall mobilities of 92.6 and 37.5 cm²/V-s were achieved for the laser-diffused phosphorous- and boron-type polysilicon films, respectively.