HomePad

Papers by Keyword: Pad

<
1
2

Paper TitlePage

A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

Authors: D.H. Lee, D.J. Kwon, Yi Koan Hong, Jin Goo Park

433

Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing

Authors: Hyoung Jae Kim, Hae Do Jeong, E. Lee, Y. J. Shin

383

A Study of the Form Error Compensation for Aspherical Lens Machining

Authors: Pei Lum Tso, Ho Chiao Chuang

369

<
1
2