Papers by Keyword: Photosensitive Resin

Abstract: Abstract. The rapid prototypes of different printing temperature by Objet30 Stratasys Pro printer were found a certain difference in performance in the process of using the process.In order to studied the effect of printing temperature on the rapid prototyping of photosensitive resin, tensile and bending tests were carried out on the rapid prototyping parts at 12°C, 18°C, 21°C, 23°C, 25°C, 30°C,respectively,and the rigidity and surface roughness of rapid prototyping parts were measured.Research shows：the tensile strength increases with the increase of printing temperature , tensile elastic modulus fluctuates with the printing temperature , they all increases rapidly after 25°C;The bending strength increases proportional with the increase of printing temperature, and the bending modulus increases first and then tends to decrease with the increase of printing temperature;The hardness value increases slowly with the increase of printing temperature, and increases obviously after 20°C,the hardness value in the middle of the prototype parts is bigger than the edge parts；The surface roughness with increasing printing temperature, although it is floating up and down, but have little effect.

Abstract: RPSL-02 type photosensitive resin for stereolithography material was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), trimethyolpropane triacrylate (TMPTA), polycaprolactone polyol (polyol-0301), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 395mPa.S, The glass transition temperature (Tg ) of the UV-cured specimen was 52°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

Abstract: In the paper, RenshapeTM SL7545 type photosensitive resin for stereolithography material was characterized by infrared (IR) and nuclear magnetic resonance (NMR) spectroscopy, showing the presence of epoxy and acrylic functional groups, as well as aromatics and aliphatic ether groups. The experimental results showed that its viscosity at 30°C was 350mPa.s, its critical exposure (Ec) was 10.4mJ/cm2, its penetration depth (Dp) was 0.17mm, the tensile strength of its cured product was 41.5MPa, the tensile modulus was 1561MPa, the elongation at break was 14.7%. With the photosensitive resin as the processing material, the part of an active pincers was fabricated using the Stereolithography Apparatus (HRPL-I), and the quality of the fabricated part was good.

Abstract: A novel technology is studied in this paper to make photosensitive resin grinding wheel based on layered manufacturing technology. The bond strength among resin layers is analyzed. An effective measure is proposed to improve the bond strength among resin layers of the grinding wheel. We add magnetic abrasive particles into the liquid resin to get rough surface and increase contact area by action of magnetic force. Some experiments are curried out for testing shear strength of resin with magnetic abrasive under different conditions. Results show that this method had a significant effect in improving the bond strength among layers of new grinding wheel.

Abstract: Stereolithography technique is dealt with the techniques of machinery, laser, numeral control, computer software and photosensitive resins, etc. The quality of the photosensitive resins has direct effect on the dimensional accuracy, mechanical properties of the fabricated parts. Therefore the further research on SL7560 type photosensitive resins is very meaningful and valuable. The properties of SL7560 type photosensitive resin were investigated by some instruments and equipments. Characteristics of FT-IR showed that SL7560 type photosensitive resin belonged to an epoxy-acrylic hybrid photosensitive resin. The experimental results showed that its viscosity at 30°C was 197mPa.s, its critical exposure (E_c) was 5.9mJ/cm2, its penetration depth (D_p) was 0.14mm, the tensile strength of its cured product was 43.7MPa, the tensile modulus was 2549MPa, the elongation at break was 10.7%. With the photosensitive resin as the processing material, the part of a mobile phone shell was fabricated using the Stereolithography Apparatus (HRPL-I), and the quality of the fabricated part was good.

Abstract: RPSL-01 type photosensitive resin for Stereolithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 425mP_a.S, The glass transition temperature (Tg ) of the UV-cured specimen was 47°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

Abstract: HBWSL-1 type photosensitive resin for Stereolithography was prepared with bisphenol A type epoxy diacrylate (EA-612), polyethene glycol (200) diacrylate (PEGDA), ethoxylated trimethyolpropane triacrylate (EO₃TMPTA), cycloaliphatic diepoxide (ERL-4221), polycaprolactone polyol(Polyol-0301), 1-hydroxycyclohexyl phenyl ketone (Irgacure184) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976). The main parameters of the photosensitive resin were as follows: the penetration depth was 0.15mm, the critical exposure was 16.6mJ/cm², the viscosity at 30°C was 215mPa.s, and the density at 30°C was 1.13g/cm³. With the photosensitive resin as the processing material, cuboid parts and double-cantilever parts were fabricated by using a stereolithography apparatus, and the dimension shrinkage factor and the curl factor were studied. The shrinkage factor was less than 1.00%, and the curl factor was less than 8.00%, which showed that the accuracy of the fabricated parts was high with the photosensitive resin for stereolithography.

Abstract: DSM SOMOS 11120 type photosensitive resin possessed the biggest consumption for the stereolithography fabricated parts. Therefore the further research on DSM SOMOS 11120 type photosensitive resin was very meaningful and valuable. In the paper, DSM SOMOS 11120 type photosensitive resin was characterized by infrared (IR) and nuclear magnetic resonance (NMR) spectroscopy, showing the presence of epoxy and acrylic functional groups. The viscosity of the 11120 type photosensitive resin were also determined, indicating that the viscosity at 30°C was 260mPa.s. Meanwhile, the mechanical and thermal properties of its UV-cured specimens were evaluated, testing that the tensile strength was 50.8MPa, the tensile modulus was 2659MPa, the elongation at break was 11.3%, and the glass transistion temperature was 49°C.

Abstract: To improve low lapping efficiency of silicon nitride balls in conventional lapping process, fixed abrasive lapping technology for ceramic balls is investigated in this paper. Diamond abrasives and photosensitive resin are used to fabricate the fixed abrasive plate. The lapped ball surface is observed with microscopy to identify the dominant wear mechanism. The results show that the material removal rate of the fixed abrasive lapping is about 20 times of that of conventional free abrasive lapping process, and the roughness is close to the conventional one. The experimental results indicate that the fixed abrasive lapping technology is a promising process to instead of conventional free abrasive lapping process for ceramic balls in rough and semi-finishing process.