Papers by Keyword: Polytype Stability

Abstract: Based on the analysis of the defect formation in silicon carbide polytypes in different semiconductor manufacturing processing steps, device operation and environmental-device interaction it is concluded that external material and energy fluxes are generally able to destabilize the polytype structure. The governing reason is the formation of stacking faults and instabilities of the partial dislocation associated with them. A new ansatz is proposed to describe the structural instabilities using none-equilibrium thermodynamics and the entropy production. A criterial form for polyype transitions is proposed. The developed criterial form is applied to describe observed structural instabilities occur­ring under different external actions.

Abstract: We investigated with ab initio calculations the 3C-, 6H-, 4H- and 2H-SiC polytypes. We discuss the geometry and the energetics of bulk and surface relaxed structures ((0001) Si face and the (000-1) C face surfaces). The polytype stability is discussed regarding the bulk and surface effects.

Abstract: The influence of nitrogen impurity on the stabilization of 3C-SiC polytype has been studied during vapour-liquid-solid (VLS) growth on 6H-SiC(0001) seed with Si-Ge melt. By changing the partial pressure of N2 during growth, it was found that the proportion of 3C-SiC inside the grown material increases with N2 partial pressure. 6H inclusions are only found for high purity (low N2 content) conditions. The possible interactions proposed to explain this effect are divided in two effects: i) lattice parameter modification and ii) surface induced lateral enlargement variation. A combination of both effects is suspected.

Abstract: We carried out investigations to elucidate the reasons for polytype changes in 4H. The aim was to sustain polytype stability throughout the entire process. The investigations were accompanied by studies on the formation of basal plane dislocations and their role as source for stacking faults. Several methods for the evaluation of material properties were applied to determine quality most precisely, e.g. KOH-defect-etching, optical microscopy, electron microscopy and X-ray-diffraction. We found out that several influences in growth conditions have to be controlled in a proper manner to achieve defect reduction. Based on these investigations we were able to improve our process and the crystal quality significantly. Best values for 3” 4H wafers show that EPD = 5x103 cm-2 , MPD < 0.1 cm-2 and FWHM-values < 15 arcsec can be achieved.

Abstract: Growth rates and relative stability of 6H- and 4H-SiC have been studied as a function of growth conditions during Halide Chemical Vapor Deposition (HCVD) process using silicon tetrachloride, propane and hydrogen as reactants. The growth temperature ranged from 2000 to 2150 oC. Silicon carbide crystals were deposited at growth rates in the 100-300 μm/hr range in both silicon- and carbon-supply limited regimes by adjusting flows of all three reactants. High resolution x-ray diffraction measurements show that the growth on Si-face of 6H- and C-face of 4H-SiC substrates resulted in single crystal 6H- and 4H-SiC polytype, respectively. The growth rate results have been interpreted using thermodynamic equilibrium calculations.