Papers by Keyword: Pull Strength

Abstract: This article proposes a new type of cracking resistant water-proof pavement structure by building mechanical model and performing lab tests. This cracking resistant water-proof layer is a composite material formed by using high performance emulsified asphalt that makes two or more kinds of crushed stone with different particle size interlocking and binding with each other. In addition to this, this article preliminary determinates three field testing indexes, which are asphalt distribution measurement, pullout strength test and shear strength test of modified emulsified asphalt. At last, it is proved that the cracking resistant water-proof layer have a favorable effect on the experimental road.

Abstract: Poly(tetrafluoroethylene)(PTFE) thin films were coated onto metal substrates by a spin coat apparatus, vacuum evaporator and RF sputtering, and their adhesion and friction properties evaluated. PTFE thin film coated onto nickel-titanium (Ni-Ti) substrate by spin coating showed a low friction coefficient, however pull strength between the thin film and Ni-Ti substrate was low. In order to increase the pull strength, PTFE and poly(vinyl alcohol) (PVA) composite thin films were introduced between the PTFE thin film and Ni-Ti substrate by spin coating. PTFE thin film was also coated onto SUS302 substrate by a vacuum evaporator. This PTFE thin film showed poor adhesion to the SUS302 substrate. The adhesion was enhanced by heating of the substrate during the evaporation. In addition, a PTFE and ethylene vinyl alcohol (EVOH) composite thin film showed higher adhesion strength than that of the PTFE thin film. Poly(fluorocarbon) thin films were prepared by a conventional RF sputtering with PTFE target. These thin films showed a higher friction coefficient than that of the pristine PTFE. Molecular structures of the poly(fluorocarbon) thin films prepared by RF sputtering were different from the pristine PTFE. This difference may have influenced the friction coefficient. The pull strength of metal thin films such as gold, copper, nickel and aluminum deposited on the sputtered PTFE thin films by vacuum evaporation was measured. The nickel thin film adhered to the PTFE thin film most strongly of all the thin films.

Abstract: The reliability of QFP (Quad flat package) solder joint using Sn-8Zn-3Bi solder paste under the thermal shock test was investigated. Considering the environmental restriction such as ROHS, the QFP Cu LF (Lead-frame) was coated with lead-free materials (Sn, Sn-3Bi). To analyze the reliability under thermal shock treatment, the samples were placed in the thermal shock chamber (248K/423K, Dwell time: 30min). During the thermal shock test, the solder joint cross-sections were observed every 500 cycles. No crack initiation and propagation was observed through all type of plated Cu LF. The measured pull strength slightly decreased, as the number of cycles increased. After 1000 cycles, the pull strength of Sn and SnBi plated Cu LF reduced by 30% and 20%, respectively, compared with that of initial condition. Observing the fracture surface morphology by FE-SEM, the fracture mode changed and the IMC fractured area on the both fracture surface was increased. The IMC was identified as γ-Cu5Zn8 by chemical composition analysis using EDS. The reduced pull strength was affected by IMC fracture and fracture mode change. However, the pull strength does not decrease steeply but gradually. Consequently, the Sn-8Zn-3Bi solder joint shows the reliable solder joint strength, fracture mechanism, and compatibility with lead-free plated Cu LF during the thermal shock temperature of 248K to 423K.

Abstract: The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.