Papers by Keyword: Raman Microscopy

Abstract: The strain fields in a 4H-SiC homo-epitaxial layer deposited on a nitrogen-doped 4H-SiC substrate were studied using Raman scattering microscopy. The cross-sectional (1-100) and (11-20) surfaces of the epitaxial substrate were examined through the peak shifts of several Raman-active phonon modes for 4H-SiC, and tensile strain was found along the direction of 4° off the c-axis at the epilayer/substrate interface. The effect of the facet trace in the substrate, which has a higher nitrogen concentration than the other parts of the substrate, was also studied. The tensile strain at the epilayer/substrate interface was found to be hardly enhanced for the epilayer deposited on the facet trace.

Abstract: Nitrogen-boron doped 6H-SiC epilayers grown on low off-axis 6H-SiC substrates have been characterized by photoluminescence and Raman spectroscopy. The photoluminescence results show that a doping larger than 10¹⁸ cm^-3 is favorable to observe the luminescence and addition of nitrogen is resulting in an increased luminescence. A dopant concentration difference larger than 4x10¹⁸ cm^-3 is proposed to achieve intense photoluminescence. Raman spectroscopy further confirmed the doping type and concentrations for the samples. The results indicate that N-B doped SiC is being a good wavelength converter in white LEDs applications.

Abstract: Micro-Raman spectroscopy has been used to study the dependence between the carrier concentration and electrical mobility in n-doped 3C-SiC films grown on (111) and (100) Si oriented substrates. Local stacking variations observed on the (111) 3C-SiC surface lead to a worse crystal morphology compared to (100) 3C-SiC films resulting in a decrease of the average bulk mobility.

Abstract: The subject of this report is the characterization of plasma etch residues after a metal etch process with Cl2/BCl3 etch gases. One of the interactive factors in the removability of the residues is the photo-mask removal process (DSQ). Depending on the DSQ process the molecular structure of the residues will differ. For our findings, we used laser spectroscopy and Fourier-transformed infrared spectroscopy to obtain information about the degree of the cross-linking of the molecular structure of residues in a post-metal etch cleaning process. The post-etch cleaning is important for removing residues remaining after the metal structuring process. The main goal is to use emission spectroscopy for studying the compounds of the dry-etch related residues. Finally, it was shown that small variations in wafer treatment directly after dry-etching results in different solubilities of residues in HDA (hydroxylamine) based solutions. [1]