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Articles by keyword: «Sn-Cu»

• An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation
  Published in: Experimental Mechanics in Nano and Biotechnology (p1035)
• Atomization Using a Pressure-Gas-Atomizer
  Published in: Progress in Powder Metallurgy (p13)
• Innovation and Annealed Effect of Sn-Al and Sn-Cu Composite Thin Films on the Electromagnetic Interference Shielding for the Green Materials
  Published in: Renewable and Sustainable Energy (p547)
• Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder
  Published in: Fracture and Strength of Solids VI (p115)
• Vibration Fracture Behavior of Sn-xCu Lead-Free Solders
  Published in: The Mechanical Behavior of Materials X (p477)