Papers by Keyword: Thin Film System

Abstract: A high-absorption of thin film system used for solar energy photon-thermal conversion is designed. Which is composed of four function parts with metals and dielectric materials. The result of design show that it has a very high absorption over 95% with wide working wavelength range from 400nm to 1000nm and incident angle from 0^o to 60^o.

Abstract: The laser-induced mass transfer in thin-film substrate /Cr/Cu/Ni system is studied by means of Auger Electron Spectroscopy (AES). For the laser-pulse energy values, E = 100-170mJ, the diffusion of Cu atoms into Ni layer and their accumulation within this layer are observed, whereas at E > 170mJ the same is true for Cr atoms. The observed phenomena are explained on the basis of calculated temperature distribution in the system at issue during lased action. Enhanced transfer of Cr atoms towards external surface is observed under the irradiation regimes leading to the melting of intermediate copper layer. Diffusion coefficients of copper and chromium calculated from their surface accumulation show an exponential dependence on the laser-pulse energy. Under laser heating, the diffusion processes are more manifested as compared with those under conventional thermal annealing. This is bound up with higher concentration of nonequilibrium defects generated within the irradiation zone.

Abstract: Influence of an annealing environment and film thickness on the phase formation in the Ti(30 nm)/Si(100), [(Ti+Si) 200 nm]/Si(100) thin film systems produced by magnetron sputtering and the Ti(200 nm)/Si(100) thin film system produced by electron-beam sputtering were investigated by X-ray and electron diffraction, Auger electron spectroscopy (AES), secondary ion mass-spectrometry (SIMS) and resistivity measurements. Solid-state reactions in the thin film systems under investigation were caused by diffusion processes during annealing in the different gas environments: under vacuum of 10-4 - 10-7 Pa, flow of nitrogen and hydrogen. It is shown that the decrease of Ti layer thickness from 200 to 30 nm in the Ti/Si(100) film system causes the increase of the transition temperature of the metastable C49 TiSi2 phase to the stable C54 TiSi2 phase up to 1070 K at vacuum annealing. During annealing in the nitrogen flow of the Ti(30 nm)/Si(100) thin film system the C49 TiSi2 is the first crystal phase which is formed at 870 K. For annealings of the [(Ti+Si) 200 nm]/Si(100) thin film system by impulse heating method or for furnace annealings in inert gas atmosphere of N2, Ar, H or higher vacuum (10-5 Pa) the crystallization process has two stages: the first metastable C49 TiSi2 phase is formed at 870 K and then at higher temperatures it is transformed to the stable C54 TiSi2 phase.