Papers by Keyword: VCA

Abstract: A VCA direct-drive 2-DOF precision positioning table is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the VCA is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. The table structural is detailed and its dynamic design approach is proposed. The prototype experiment shows that the new 2-DOF positioning table is of higher speed and higher accuracy than the traditional ones.

Abstract: Proposed technique of hyperspectral unmixing is apparent to implement and compute the results in a very fast and efficient manner. To reducing the computational complexity and to estimation of hyperspectral data we adopted a statistical method of median absolute deviation about median. Number of end-members is enumerating by self iterative subspace projection method which depends on Pearson correlation. The mixing matrix is inferred by using Q function projections. A set of tests with real hyperspectral data evaluates the performance and illustrates the effectiveness of the proposed method. For the evaluation of proposed method, the results are compared with the results of vertex component analysis. The experimental results show the effectiveness of proposed method on hyperspectral unmixing. targets Alunite, Buddingtonite, Calcite, Kaolinite, and Muscovite are detected well and have high spectral similarities. Hyperspectral remote sensing is used in a large array of real life applications e.g. Surveillance, Mineralogy, Physics, and Agriculture. The complete work is prepared by using MATLAB.

Abstract: In order to improve the precision and efficiency of IC packaging for wafer wire bonding equipment, a new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward. By establishing dynamic model of VCA and positioning table, the electromechanical coupling control system based on minimum deadbeat response controlling algorithm is proposed. The prototype experiment shows that the new 2-DOF positioning table is robust and of good dynamic performance.

Abstract: A new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the driving element is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. By establishing dynamic model of VCA and positioning table, an electromechanical coupling control system based on displacement PID controller is proposed. The prototype experiment shows that the new 2-DOF positioning system is of higher speed and higher accuracy than the traditional ones.