Papers by Keyword: Yield Enhancement

Abstract: A methodology is developed statistically to make MEMS devices robust to process variations to improve manufacturability and yield. Two approaches are applied to discuss the effects of multi-process variations. Comparisons have been made between the proposed method and Monte Carlo simulations, which confirm the robustness of the proposed one with performance error less than 4%. Experiments on beams and comb-drive resonator verified the effectiveness of the methodology and it is useful for practical device designs to be more robust to process variations and yield enhancement realization.

Abstract: The interaction between photo resist and highly polymerizing dry etch chemistries results in the deposition of fluoropolymers on the bevel and edge of silicon wafers. These polymers are inert to most aqueous processing chemicals, but exposure to HF lifts these polymers off the bevel. This results in migration of defects to the face of the wafers. The defects are generally found within 50mm from the edge of the wafer.

Abstract: With decreasing critical size of micro-electronic fabrication imposed by ITRS today, Front Opening Unified Pod (FOUP) has been designed to transport the silicon wafers in the 300 mm semiconductor fab to decrease the particles contamination, without taking the Airborne Molecular Contamination (AMC) and moisture problems into account. Various methods of AMC decontamination methods has been introduced in past, such as purging mini-environment with nitrogen, however the efficiency of its yield improvement capacity has not been proven. An ultimate AMC decontamination method with vacuum decontamination and passivation technology shows a very good efficiency on the AMC removal mechanism, with a direct impact on the yield improvement.