Materials Science Forum
Vols. 768-769
Vols. 768-769
Materials Science Forum
Vol. 767
Vol. 767
Materials Science Forum
Vol. 766
Vol. 766
Materials Science Forum
Vol. 765
Vol. 765
Materials Science Forum
Vol. 764
Vol. 764
Materials Science Forum
Vol. 763
Vol. 763
Materials Science Forum
Vol. 762
Vol. 762
Materials Science Forum
Vol. 761
Vol. 761
Materials Science Forum
Vol. 760
Vol. 760
Materials Science Forum
Vol. 759
Vol. 759
Materials Science Forum
Vol. 758
Vol. 758
Materials Science Forum
Vol. 757
Vol. 757
Materials Science Forum
Vol. 756
Vol. 756
Materials Science Forum Vol. 762
Paper Title Page
Abstract: Micro-structured surfaces with drag reduction, desorption, and excellent optical performance are widely used in the field of automotive, aerospace, marine applications. Therefore, the manufacturing of the micro-structure on the metal surface is of high impotance. Although the processing methods for micro-patterning of surfaces have progressed in recent years, micro-structure processing is still not used on large metal surfaces. In this paper, a method of roll forming micro-structure on the plate surface is proposed. A simulation model for micro-structure roll forming (MRF) was presented by using three-dimensional finite element method (FEM). The strain and stress, and the displacements caused by micro-structure were analyzed. The results provide theoretical guidance for the design of different micro-structures and the sequence of their processing.
763
Abstract: In this paper, the finite element method (FEM) was implemented to determine the effective thermal conductivity of SiC particle reinforced Al matrix (SiCp/Al) composites containing various pores and that method was validated by experimentation. A commercially available finite-element package ANSYS is used to for this numerical analysis. Multi-particle and pores random distribution models based on the effective medium approximation (EMA) scheme are constructed to simulate the microstructure of composite materials for various porosities ranging from 0.96 to 10.58%. The SiCp/Al composites were fabricated by the pressureless infiltration method. This study shows that the smaller pores contained in the composite results in sharp reduction of thermal conductivity, when the porosity is up to 2.66 vol.%, the thermal conductivity of composite is found to decrease by about 9.02%. The experimentally measured thermal conductivity values are compared with the numerically calculated ones and also with the existing theoretical and empirical models. The values obtained from finite-element analysis (FEA) are found to be in reasonable agreement with the experimental values.
769
Abstract: The paper contains the description of a method, equipment and results for predicting the wear resistance of cemented carbide cutting inserts by measuring their thermal diffusivity. Strong correlation between wear resistance and thermal diffusivity was found. This presented method has been patented.
777
Abstract: A Model of Chip Formation with a Single Conditional Shear Surface Cannot be Implemented in Determining the Stresses and Strains in the Blank and Chip neither Nor in Determining the Contact Stresses at the Working Sections of the Front and Read Cutter Surfaces. at the same Time, it has been Established Experimentally that the Cut Layer is Converted to Chip in a Plastic Zone of Complex Form. Numerous Attempts have been Made to Simulate this Zone by Constructing Slip-Line Fields. According to Plasticity Theory, Slip Lines Constitute Two Families of Mutually Orthogonal Curvilinear Coordinates, along which the Maximum Tangential Stress Acts. if the Kinematically Possible Slip-Line Field is Constructed, it is Possible to Calculate the Stress–strain State in the Chip-Formation Zone.
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