Latest publications

Technology of Plasticity
Editors:
Gou-Jen Wang, Dr. Yeong-Maw Hwang, Kuang-Jau Fann and Cho-Pei Jiang
Online since:
April 2018
Periodical and volume:
Materials Science Forum Vol. 920
Description:
This special volume includes the papers presented at the First Asia Pacific Symposium on Technology of Plasticity (APSTP 2017, National Chung Hsing University, Taichung, Taiwan, November 22-25, 2017) and covers the results of research and development in the area of the metal plasticity, metal forming processes and related technologies.
Traditional and Advanced Ceramics III
Editors:
Dr. Somnuk Sirisoonthorn, Dr. Sirithan Jiemsirilers, Thanakorn Wasanapiarnpong, Dr. Nutthita Chuankrerkkul, Rojana Pornprasertsuk, Nisanart Traiphol and Pornapa Sujaridworakun
Online since:
April 2018
Periodical and volume:
Key Engineering Materials Vol. 766
Description:
We present for readers the book that was collected by results of the International Conference on Traditional and Advanced Ceramics (ICTA2017, August 31 - September 1, 2017, Bangkok, Thailand) which was devoted to the most updated researches in area of ceramic industry, advanced ceramic materials and metal oxides, ceramic art and design, glass and coatings technology, materials testing and characterization.
Electronic Packaging Interconnect Technology
Editors:
Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir
Online since:
April 2018
Periodical and volume:
Solid State Phenomena Vol. 273
Description:
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Structural Integrity of Welded Structures XII
Editors:
Nicușor Alin Sîrbu and Aurel Valentin Bîrdeanu
Online since:
April 2018
Periodical and volume:
Advanced Materials Research Vol. 1146
Description:
This volume includes the selected papers presented at the 12th International Conference: Structural Integrity of Welded Structures (ISCS 17, Timişoara, Romania, November 9 - 10, 2017) and is focused on the actual problems of structural integrity, application of the welded technologies and welded structures and advanced structural materials in the modern mechanical engineering.
Novel Trends in Production Devices and Systems IV
Editors:
Daynier Rolando Delgado Sobrino and Karol Velíšek
Online since:
April 2018
Periodical and volume:
Materials Science Forum Vol. 919
Description:

The present publication arises as a result of the cooperation between the Institute of Production Technologies (IPT), belonging to the Faculty of Materials Science and Technology (MTF) of the Slovak University of Technology (STU) and TRANS TECH PUBLICATIONS INC. For the fifth time, the book aims at publishing scientific achievements on the Materials Science and Production Technologies fields, as well as at enhancing the worldwide cooperation and recognition among young and senior academicians and/or practitioners. Some of the main topics included in the book are those related but not limited to the trends in Materials Science and their application in industry, e.g.: composites and biomaterials, polymers, materials weldability, analysis of metals and alloys, numerical analyses and simulation of materials, etc. Most of these topics keeps a direct relation to the production technologies and systems and thus, always keeping a special focus on the materials used, there are also topics in the book addressing key production processes, technologies and systems.