Latest publications

Wafer Processing

Wafer Processing
Editors:
Sang Mo Koo and Hoon Kyu Shin
Online since:
May 2026
Description:
This special edition focuses on scientific principles and the technologies that underpin the preparation and processing of SiC wafers. The technological operations involved in transforming a bulk SiC crystal into a device-ready substrate are described. The presented information will contribute to continued advances in manufacturing and the development of the next generation of high-performance electronic devices.

Performance Analysis of SiC Power Devices

Performance Analysis of SiC Power Devices
Editors:
Sang Mo Koo and Hoon Kyu Shin
Online since:
May 2026
Description:
This special edition presents the results of an evaluation of silicon carbide (SiC) based power device performance and is intended as a valuable resource for researchers, engineers, and graduate students engaged in power semiconductor development and their reliability analysis.

SiC Devices for Quantum Applications and Harsh Radiation Environments

SiC Devices for Quantum Applications and Harsh Radiation Environments
Editors:
Sang Mo Koo and Hoon Kyu Shin
Online since:
May 2026
Description:
This special edition explores the broad spectrum of phenomena that govern the functionality, performance, and reliability of SiC-based devices under demanding exploitation conditions and quantum applications. The presented research results will serve as a valuable resource for researchers, engineers, and graduate students working at the intersection of wide-bandgap semiconductors, quantum technologies, and radiation-hardened electronics.

Interface, Dielectrics and Ohmic Contact in SiC Power Devices

Interface, Dielectrics and Ohmic Contact in SiC Power Devices
Editors:
Sang Mo Koo and Hoon Kyu Shin
Online since:
May 2026
Description:
This special edition provides a comprehensive perspective on engineering research results and technological solutions in the area of charge-transport across interfaces and contacts in SiC devices and is intended for researchers, process engineers, and graduate students engaged in the development of next-generation wide-bandgap electronics.

Journal of Biomimetics, Biomaterials and Biomedical Engineering Vol. 72

Journal of Biomimetics, Biomaterials and Biomedical Engineering Vol. 72
Editors:
Prof. Jong Hak Kim, Dr. Endarto Yudho Wardhono and Prof. Ramesh K. Agarwal
Online since:
May 2026
Description:
This 72nd volume of the journal is entirely dedicated to materials for biomedical applications, ranging from percutaneous coronary intervention using balloon stents and wound dressings to dental restoration, orthopaedic implants and biosensors. Materials synthesis and processing, along with their mechanical and antibacterial properties, are analysed here. The collected articles will be of interest to many specialists in biomaterials.