Sort by:
Publication Type:
Open access:
Publication Date:
Periodicals:
Search results
Online since: December 2024
Authors: Tian Hong Gu, Shu Wei Jiang, Wen Su
Sample and Tensile Testing
Material and Sample Geometry.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
Online since: September 2015
Authors: Tsung Chia Chen, Ming Long Xu
Makinouchi, Shell-Element Formulation in the Static Explicit FEM Code for the Simulation of Sheet Stamping, Journal of Materials Processing Technology 50 (1995) 105-115
Leu, Finite-element simulation of the lateral compression of aluminium tube between rigid piates, International Journal of Mechanical Sciences 41 (1999) 621-638
Chien, Influence of the punch profile the limitation of formability in the hole-flange process, Journal of Materials Processing Technology 113 (1999) 720-724
Kang, Finite Element Investigation on Spring-Back Characteristics in Sheet Metal U-Bending Process, Journal of Materials Processing Technology 141 (2003) 109-116
Antonio, Optimal Design of V and U Bending Processes Using Genetic Algorithms, Journal of Materials Processing Technology 172 (2006) 35-41
Leu, Finite-element simulation of the lateral compression of aluminium tube between rigid piates, International Journal of Mechanical Sciences 41 (1999) 621-638
Chien, Influence of the punch profile the limitation of formability in the hole-flange process, Journal of Materials Processing Technology 113 (1999) 720-724
Kang, Finite Element Investigation on Spring-Back Characteristics in Sheet Metal U-Bending Process, Journal of Materials Processing Technology 141 (2003) 109-116
Antonio, Optimal Design of V and U Bending Processes Using Genetic Algorithms, Journal of Materials Processing Technology 172 (2006) 35-41
Online since: April 2014
Authors: Federica Cucchiella, Massimo Gastaldi
Energy Education Science and Technology Part A: Energy Science and Research, 30, 1, 673-692
Journal of Cleaner Production 2013
European Journal of Operational Research 154: 437-446
Advanced Materials Research, 827, 435-440
European Journal of Operational Research 2: 429-444
Journal of Cleaner Production 2013
European Journal of Operational Research 154: 437-446
Advanced Materials Research, 827, 435-440
European Journal of Operational Research 2: 429-444
Online since: July 2021
Authors: Khetam S. Ateah, Luay S. Alansari
It is combined of two materials, typically metal and ceramic.
Mortensen, Functionally graded materials, London: The Institute of Materials, IOM Communications Ltd., 1998
Journal of Engineering and Applied Science. 2004; 51:543-58
Journal of Mechanics of Materials and Structures. 2014; 9:465–474
Series: Materials Science and Engineering 473 (2019) 012028; doi:10.1088/1757-899X/473/1/012028 [23] Hayder Z.
Mortensen, Functionally graded materials, London: The Institute of Materials, IOM Communications Ltd., 1998
Journal of Engineering and Applied Science. 2004; 51:543-58
Journal of Mechanics of Materials and Structures. 2014; 9:465–474
Series: Materials Science and Engineering 473 (2019) 012028; doi:10.1088/1757-899X/473/1/012028 [23] Hayder Z.
Online since: October 2010
Authors: Wei Hong Zhang, Ji Hong Zhu, Xiao Jun Gu
The total resin material cost is constrained
to be 20% of the original design with full material usage.
Acknowledgement This work was supported by a grant from National Science Fund for Distinguished Young Scholars (No. 10925212), the National Natural Science Foundation of China (90916027), 111 Project (B07050), the Key Sci-Tech Project of the Ministry of Science and Technology (2009ZX04014-75) and the Basic Research Foundation of Northwestern Polytechnical University (CJ201009).
Dickens: Rapid Prototyping Journal Vol. 7 (2001), p. 66-72 [5] C.
Braibant: International Journal of Numerical Methods in Engineering Vol. 23 (1986), p. 409-428 [6] K.
Svanberg: International Journal for Numerical Methods in Engineering Vol. 24 (1987), p. 359-373
Acknowledgement This work was supported by a grant from National Science Fund for Distinguished Young Scholars (No. 10925212), the National Natural Science Foundation of China (90916027), 111 Project (B07050), the Key Sci-Tech Project of the Ministry of Science and Technology (2009ZX04014-75) and the Basic Research Foundation of Northwestern Polytechnical University (CJ201009).
Dickens: Rapid Prototyping Journal Vol. 7 (2001), p. 66-72 [5] C.
Braibant: International Journal of Numerical Methods in Engineering Vol. 23 (1986), p. 409-428 [6] K.
Svanberg: International Journal for Numerical Methods in Engineering Vol. 24 (1987), p. 359-373
Online since: April 2026
Authors: Thorsten Schüppstuhl, Jan Erik Rath, Doran Nettig, Johann Kipping
Ostrikov, K., Advances on Incremental forming of composite materials, Alexandria Engineering Journal (2023), 308–336. 10.1016/j.aej.2023.07.045
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Materials Research Proceedings.
Online since: January 2013
Authors: Shu Cai Li, Wan Tao Ding, Jin Hui Liu
Predictive models for deterioration of concrete structures.Construction and Building Materials,Vol.10(1996),p.27-37
Effect of reinforcement corrosion on bond strength.Construction and Building Materials ,Vol.10(1996),p.123-129
(In Chinese) [4] Yuxi Zhao,Weiliang Jin.Journal of Zhejiang University(Engineering Science), Vol.36(2000), p.352-356.
Numerical simulation of potential distribution due to the corrosion of reinforcement in concrete structures.Materials and Structures, Vol.38(2005), p.711-719
Chinese Journal of Rock Mechanics and Engineering,Vol.23(2004),p.2235-2242.
Effect of reinforcement corrosion on bond strength.Construction and Building Materials ,Vol.10(1996),p.123-129
(In Chinese) [4] Yuxi Zhao,Weiliang Jin.Journal of Zhejiang University(Engineering Science), Vol.36(2000), p.352-356.
Numerical simulation of potential distribution due to the corrosion of reinforcement in concrete structures.Materials and Structures, Vol.38(2005), p.711-719
Chinese Journal of Rock Mechanics and Engineering,Vol.23(2004),p.2235-2242.
Online since: May 2013
Authors: Xiao Ming Zhang, Shu Wen Ding, Shuang Xi Li
Root systems, as the reinforced materials, are essential to increase slope stability and mitigate soil erosion.
The average root diameter could be calculated by Equation (1): (1) The two ends of root (,) was clipped with soft materials.
Ali: International Journal of the Physical Sciences.
Liu: Journal of Subtropical Resources and Environment.
Ma: Journal of Fujian Agriculture and Forestry University (Natural Science Edition).
The average root diameter could be calculated by Equation (1): (1) The two ends of root (,) was clipped with soft materials.
Ali: International Journal of the Physical Sciences.
Liu: Journal of Subtropical Resources and Environment.
Ma: Journal of Fujian Agriculture and Forestry University (Natural Science Edition).
Online since: January 2022
Authors: Guang Yu Yang, Wan Qi Jie, He Qin, Shi Feng Luo, Tong Bai
Materials Science & Engineering A, 2002, 327(2): 167-185
Gündüz, Dendritic Growth in an Aluminum-Silicon Alloy, Journal of Materials Engineering & Performance, 16 (2007) 12-21
Journal of Materials Science, 2000, 35(15): 3837-3848
Metallurgical Transactions a-Physical Metallurgy and Materials Science, 1976, 7(6): 811-820
Journal of Materials Science, 1993, 28(21): 5957-62
Gündüz, Dendritic Growth in an Aluminum-Silicon Alloy, Journal of Materials Engineering & Performance, 16 (2007) 12-21
Journal of Materials Science, 2000, 35(15): 3837-3848
Metallurgical Transactions a-Physical Metallurgy and Materials Science, 1976, 7(6): 811-820
Journal of Materials Science, 1993, 28(21): 5957-62
Online since: November 2011
Authors: Xing Ai, Zhan Qiang Liu, Yang Qiao
Mendez: Materials Science and Engineering A Vol. 399 (2005), p. 199-205
[2] W.
Bhadeshia: Materials Science and Engineering A Vol. 223 (1997), p. 64-77 [4] W.M.
Thomas: Metallurgical and Materials Transactions A Vol. 38A (2007), p. 1330-1336 [6] J.L.
Danninger: Journal of Materials Processing Technology Vol. 176 (2006), p. 62-69 [8] A.R.C.
Ridgway: Journal of Materials Processing Technology Vol. 200 (2008), p. 424-432
Bhadeshia: Materials Science and Engineering A Vol. 223 (1997), p. 64-77 [4] W.M.
Thomas: Metallurgical and Materials Transactions A Vol. 38A (2007), p. 1330-1336 [6] J.L.
Danninger: Journal of Materials Processing Technology Vol. 176 (2006), p. 62-69 [8] A.R.C.
Ridgway: Journal of Materials Processing Technology Vol. 200 (2008), p. 424-432