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Material parameters obtained from experiments are listed in Table 1.
Acknowledgements This work was financially supported by the Hunan Natural Science Foundation (10JJ2041) and Natural Science Foundation of China (50974076).
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Mechanisms of orthogonal cutting and resulting chip formation are discussed in terms of composite materials, tool geometry and cutting forces [5].
The mechanical and thermal properties of both materials are described in Table 1.
Results and discussion � Figure 1 shows the evolution of the shear plane angle (Φ) as function of the chip compression rate (Rc) for both materials.
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Development of Wear-Resistant Materials Based on Polytetrafluoroethylene and Carbon Fibers of UVIS-AK-P Brand M.A.
Materials and methods of research.Commercially manufactured polytetrafluoroethylene (PTFE) serves as the polymer matrix.It refers to materials of antifriction purpose that can function in a wide range of temperatures (from minus 269 ° C to plus 250 ° C).
Materials science. 4 (2012) 37–40
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Series: Materials Science and Engineering. 262 (2017) 1-6 (Paper № 012200).

Experimental Materials.
In the Figure 2, the oil absorption rates of the two materials had different degrees of increase in size with the increase in the number of recycling.
But the increase was smaller, thus ensuring the material can be recycled many times to keep the material within the more foam, so that the material had good mechanical properties and the use of performance.
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Modelling and Simulation in Materials Science and Engineering, 17(1) (2009)
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Some researchers prove that this model is applicable only for some materials and loading cases.
Materials and their test programs For the purpose of model verification, the authors have chosen a variety of materials under various block load programs.
The materials used for calculations have undertaken different block loading programs.
Results The calculations have been performed for four materials.
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All materials, such as sunflower, corn, palm, and sodium hydroxide, are weighed.
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Materials Letters, 77(23), 38–40
Journal of Colloid and Interface Science 1