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Various ceramic materials with a permittivity of from 5 to 20000 are used as a dielectric in the MLCC.
The use of various materials makes it possible to obtain a wide range of MLCC characteristics.
Reviews on advanced materials science, 40(3) (2015) 262-275
Popovich, Characterization and Electrochemical Performance at High Discharge Rates of Tin Dioxide Thin Films Synthesized by Atomic Layer Deposition, Journal of Electronic Materials, 46(11) (2017) 6571-6577
Mikkenie, Materials Development for Commercial Multilayer Ceramic Capacitors, Netherlands, 2011

The piezoelectric ceramic used here is PZT 4 and the materials of the elastic body are brass, copper and SUS 304.
As a result of analysis depending on change in the material, the order of resonance frequency was determined according to the speed of sound, which has relation to Young’s modulus and density. [9] In case of SUS304, which has the highest resonance frequency among three materials, the highest output voltage was also shown because of high Young’s modulus.
Analysis of the output voltage depending on the applied Frequency When the materials of the elastic body were changed, the output voltage of generator using SUS304 was higher than the other generators because of high Young’s modulus.
Gonzalez, Antonio Rubio and Francesc Moll, " Human Powered Piezoelectric Batteries to Supply Power to Wearable Electronic Devices", International Journal of the Society of Materials Engineering for Resource, p. 7, 2001
Jun, "Design and Fabrication of Piezoelectric Generator using Piezoelectric ceramics", Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol. 9, pp.315-316, 2008 [4] J.

Modeling of Engineering Ceramics Grinding Surface Residual Stress Weixiang Liu 1,a 1 Hunan Institute Of Science And Technology, Yueyang ,Hunan, China alwxhnyy@126.com Keywords: Engineering ceramics, Surface residual stress, Grinding, Modeling.
Because of hard and brittle properties of ceramic materials, grinding and polishing the surface is the main processing methods, after grinded and polished, ceramics surface appear residual stresses and resulting in the cracks.
Introduction Engineering ceramic materials have been widely used in electronics, machinery, chemical industry, communications and other fields.Because of hard and brittle properties of ceramic materials, grinding and polishing the surface are their main processing methods, and after grinded, polished the surface , surface cracks are the main problems affecting the quality of the machined surface, and the residual stress is an important cause of crack.
International Journal of Advanced Manufacturing Technology.
International Journal of Machine Tools & Manufacture, May2012, Vol. 56.

Ruffini, Effect of the training set size on springback control by neural network in an air bending process, Journal of Materials Processing Technology, Vol. 80–81 (1998), p.493–500 [3] R.
Hambli, Optimization of Blanking Processes Using Neural Network Simulation, The Arabian Journal for Science and Engineering, Vol. 30 (2005), p.3-16 [6] K.
Ramakrishnan, Application of Neural Network in Sheet Metal Bending Process, Defence Science Journal, Vol. 55 (2005), p. 125-131 [7] K.
Qiu, Springback prediction for sheet metal forming based on GA-ANN technology, Journal of Materials Processing Technology, Vol.187–188 (2007), p.227–231 [9] M.
Golcu, Artificial neural network analysis of springback in V bending, journal of applied science, Vol. 8 (17) (2008), p.3038-3043 [10] F.

The high-pressure gas is found as the best alternative to TNT material, for reducing the deflection produced.
Urdea, Stress and vibration analysis of a drone, IOP Conference Series: Materials Science and Engineering. 1009 (2021) 012059
Song, Vibration reduction and firing accuracy improvement by natural frequency optimization of a machine gun system, Journal of Mechanical Science and Technology. 29 (2015) 3635-3643
Applied Mechanics and Materials. 574 (2014) 32–35
Journal of Mechanical Science and Technology. 31 (2017) 2663-2670

SiC film demonstrates low friction and superior scratch and wear resistance when compared to the other materials currently used in MEMS devices [16].
The various surface roughness value of different surface materials are shown in Fig. 3.
For all of the surface materials, larger normal forces lead to smaller friction force.
Fig. 6 show the contact angle changes with various surface materials, surface roughness values, and roughness directions.
Zhao: Applied Surface Science.

Surface Chemical Modification and Characterization of Nano-Fe2O3 Yan Liu1,a, Heyi Ge1, Xiuzhi Zhang1,Shifeng Huang1, Xin Cheng1,b＊ 1 Shandong Provincial Key Laboratory of Preparation and Measurement of Building Materials, University of Jinan, Jinan 250022, P.R.
China School of Material Science and Engineering, University of Jinan, Jinan 250022, P.R.
Materials and experimental methods 2.1 Raw Materials Nano-Fe2O3 and silane coupling agent 3-(methacryloyloxy) propyltrimethoxysilane (KH-570) were purchased by Shanghai Aladdin Industrial Co., Ltd, China.
[2] Chun-ying Min, Yu-dong Huang and Li Liu: Journal of Materials Science Vol. 42 (2007), p. 8695
Zec: Journal of materials science letters Vol. 22 (2003), p. 235

It is suitable for semiconductor substrate materials as a replacement of Al2O3, and BeO [1-5].
In addition, aluminum nitride ceramics can also be used for infrared and radar penetrating material.
This makes it possible for people to use whiskers with excellent mechanical, thermal and other properties, to improve thermal conductivity for the existing electronic packaging materials through the material compound technology.
References [1] Li Guangyu, Li Zidong and Jin Ye. properties of whisker and its application progress, thermosetting resin,2000,15 (2): 48-51 [2] Pan Jinsheng, CHAN Wing-Wah. whisker and its application of journal of composites,1995, 12 (4): 1-7 [3] Wei ming, Wang chunbo, Ying; progress of inorganic whisker research, Salt LakeResearch,2004,12 (4): 58-62 [4] Li Qiang , Jin Zhiliang and Zhang Zhihong. application and synthesis of inorganic whisker materials, the progress of chemistry,2003, 15 (4): 264-273 [5] Yuan Jianjun. research progress of whisker, materials science and technology,1996, 14 (4): 15-21 [6] Jiecai Han, Shanyi Du.Combustion synthesis of AlN whiskers,SCI,2006,41:1697-1703 [7] Weimer A W, Cochran Ga , Eisman Ga , et al.Rapid Process for Manufacturing Alumunum Nitride Powder,Journal of the American Ceramic Society,1994,71 (1) : 3-18 [8] Slack Ga , Mcnell Y T F.Growth of High Purity AlN Crystals,[J]Crystal Growth,1976 ,34 : 263-270 [9] Kohn Ja , Cotterpg, Potter Ra.Synthesis
of Aluminum Nitride Monocrystals,American Mineralogis,1956,41 : 355-361 [10] Fu Renli, Lu Chen. research progress of aluminum nitride whiskers, progress in natural science,1998, 8 (2): 513-519

Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China; 2.
Yantai Jinli New Materials Co., Ltd; 4.
Journal Of Materials Research. 29 (2014) 1500-12
Chemistry of Materials, 2000, 12(1): 19-21
Materials science forum, 2007, 554: 197-200

Preparation and Characterization of Low MWCO PES/SPSF Blend Ultrafiltration Membrane Qin Hou, Xiao-li Dinga, Yu-zhong Zhangb, Li-gang Lin and Hong Li State Key Laboratory of Hollow Fiber Membrane Materials and Processes, School of Material Science and Engineering, Tianjin 300387, China aXiaoliding.tjpu@gmail.com, bZhangyz2004cn@163.com Keywords: PES/SPSF, Ultrafiltration, Low MWCO Abstract.
In the present investigation, blend membranes based on PES/SPSF in the UF range have been prepared and characterized [5, 6]. 2 Experimental 2.1 Materials.
Acknowledgements This research was sponsored by the National Natural Science Foundation of China (Funding No. 50973083, No. 50473025, No. 51173132, No.21006070), Tianjin City High School Science & Technology Fund Planning Project (No. 20090514)，the Open Project of State Key Laboratory of Hollow Fiber Membrane Materials and Membrane Processes (No. 201012), the Research Fund for the Doctoral Program of Higher Education (No. 20091201120002) and Tianjin Natural Science Foundation of China (No. 11JCZDJC21200, 11JCZDJC23700).
Qusay: Journal of Membrane Science, Vol. 233 (2004) p.101
Chen: Journal of Membrane Science, Vol. 284 (2006) p.301–312.