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Therefore, during the process, the resolution and precise alignment factors are taken into account to prevent circuit and device failure.
Semiconductor materials possess electrical and physical properties that allow the unique functions of semiconductor devices and circuits [9].
These properties are examined along with the basics of atoms, electrical classification of solids, and intrinsic and doped semiconductors.
Factors like resist thickness and developer concentration are almost constant for both device features.
Based in the mechanical properties of the device structure, major factors could be affected.

The purpose was to perform local alloying in the form of surface network of four tracks (each two are parallel and perpendicular to the other two) to produce a good thermal and electrical properties bulk material with reasonable surface hardness properties.
The morphological features of the subsurface laser treated layers and their mechanical properties (microhardness) have been studied on oblique sections through the laser fused tracks.
Laser treatment improves the surface properties of materials in many ways.
Better properties can be achieved such as hardness, heat stability and wear resistance.
However, the results of these experiments showed no improving in cutting properties [2].

To control the properties of materials requires a new method, the database of comprehensive evaluation of physical and chemical factors of the technological chain of energy efficiency of the process of ensuring coherent combining of atoms.
Structural organization and compound properties are firstly determined by the type of chemical bonds between the elements of the interface.
The dominance of metallicity degree over the covalence provides less energy of the electrons with the atomic cores and their greater delocalization and mobility, in other words, greater probability of the wave properties, quantum-mechanical effects and increased reactivity developments, such as particle coagulation and chemical reactants.
It is the basis for expansion in the region pairing information about the mechanical properties of the density and temperature.
General principles, mechanical, thermal, and emission properties: Monograph] UE "Tehnoprint" (2004) 399 p

When the earthquake happens, the factor affecting the seismic response of underground structure is the foundation deformation rather than the inertia force.
Table 1 The main physical and mechanical properties of soil layer Layer number name of soil layer layer depth/m natural density /(kN·m-3) Possion’s ratio compression modulus/MPa cohesive strength/kPa internal friction angle/° average shear wave velocity/(m/s) dynamic elastic modulus/MPa dynamic shear modulus/MPa ① miscellaneous fill and plain fill 2.8 16.8 0.33 7.5 10 15 118 ②1 clayey silt with silty clay 1.6 18.5 0.30 5.34 11 22.0 132 ③1 sandy silt 5.5 18.7 0.28 10.96 5 29.5 159 141.7 47.4 ③2 sandy silt with silt 5.4 18.8 0.26 12.05 1 30.5 202 228.4 76.6 ③4 clayey silt with muddy clayey silt 3.3 18.3 0.32 6.88 5 24.0 163 144.6 48.4 ③8A clayey silt 9.4 18.5 0.27 8.15 3 27.0 189 194.2 65.1 ③8B silt 6.4 18.7 0.26 11.01 0 32.0 244 332.1 111.6 ⑥1-⑦1 clay 8.1 18.9 0.32 6.03 32.5 16.2 208 166.2 55.6 ⑦2 silt with silty clay 8.7 18.3 0.26 8.50 3 23.0 237 ⑨1 silty clay 3.2 19.4 0.31 6.84 35 15.5 215 In the analysis, the gravity is only considered and the lining segment is reinforced
According to the characteristics of large underground structure’s seismic response, the deformation of the surrounding soil is the main factor on seismic response of underground structure.
According to the characteristics of large underground structure’s seismic response, the deformation of the surrounding soil is the main factor that affects the seismic response of underground structure.

Also, their mechanical and rheological properties were evaluated.
RS %=wt-w0wmax-w0x 100 (3) Mechanical properties.
Rheological properties.
Fig. 5: MSD (left) and EWC (right) for the synthesized bicomponent materials Mechanical properties.
The mechanical and rheological properties of the studied compositions are consistent with the data regarding the compositions’ water uptake capacity.

Passive Strain Transfer Analysis of Wireless SAW Torque Sensor Lijiu Wang 1, a *, Yuntao Zhang 2,b and Xipeng Li3,c 1 Key laboratory of Fundamental Science for Advanced Machining, School of Mechanical Engineering, Beijing Institute of Technology, Beijing, 100081,China 2 Key laboratory of Fundamental Science for Advanced Machining, School of Mechanical Engineering, Beijing Institute of Technology, Beijing, 100081,China 3 Key laboratory of Fundamental Science for Advanced Machining, School of Mechanical Engineering, Beijing Institute of Technology, Beijing, 100081,China awanglijiu@bit.edu.cn, b176304129@qq.com, clixipeng2008@163.com Keywords: Surface Acoustic Wave , FEA, strain transfer, passive wireless Abstract.
Torque measurement based on the SAW technology has advantages of high measuring accuracy, fast response and passive wireless property, overcoming disadvantages of strain gauge measurement, grating measurement, etc.
There are many factors that affect the strain transfer.
By studying the relationship between these factors and strain transfer, we will provide a theoretical basis for optimizing the design of sensor structure.

And the reaction product, CSH gel, is the main factor in strength gain.
It is evident that the performance of Sanhetu is better than common concrete, exhibiting excellent durability through time and possessing superior chemical and physical properties.
Sanhetu, an inorganic composite, has evolved into organic-inorganic composite during development, with the increase of mechanical properties.
Factors affecting the pozzolanic activity include the mineralogical nature and chemical composition of the raw materials, water solid ratio (W/S), curing condition (time, temperature, pH, etc.).
The mixing technology seriously affected the compressive strength.

Although the effect of the reinforcing phase on the mechanical properties of the amorphous matrix at room temperature has been extensively studied in recent years [7], little attention has been given to the deformation of BMG composites in the supercooled liquid region.
There exist various models to elucidate the mechanical deformation behavior at high temperature of amorphous alloy.
The pre-exponential factor 0ε& ranges from 1x10 -3s-1 to 3x10 -3s-1.
Larger initial void size (or, equivalently, a larger initial void fraction) can weaken the mechanical properties of the BMG composite.
Spaepen: Mater Sci Eng A -Structural Materials Properties Microstructure and Processing, Vol.179 (1994), p. 81.

Because traditional resonant linear piezoelectric motors work in the unstable resonance state, the process error, frictional temperature rise and other factors will affect the stability and the mechanical properties of these motors [6].
(2) Fig. 2 Displacement amplification of drive foot Let lever magnification factor is γ.
Thus: (5) Where, γ and γ’ is the displacement amplification factors of x-axis and y-axis respectively and both are constants greater than 1. xc and yc is the displacement of point C in x direction and in y direction.
The displacement of the Y-axis was inversely proportional to tangent value of θ, i.e. the less the angle θ is, the larger the magnification factor is.
Then the maximum magnification factor can be obtained when H is 0.8mm and θ is 12°

Research on integrated quality architectureof remanufacturing industry for CQI Juan Li School of Mechanical Engineering, Xi' an University Of Science and Technology, Xi'an, China e-mail: juanlizi@163.com Keywords: Continuous quality improvement; Quality information; Bill of material.
Introduction With the continuous development of remanufacturing, remanufacturing product quality become an important factor constrained survival and development of remanufacturing industry, which has a direct impact on product sales and operating efficiency of remanufacturing industry.
Classification And Organization Of Quality Information In The Remanufacturing Industry Process quality is an important factor affecting the quality of products, so the quality information of the remanufacturing industry includes product quality information and process quality information, which insisted of the quality standards information and the quality assessment information[4].
The module rolls in providing a clear remanufacturing product structure, and building up association with remanufacturing process management module. 2）Remanufacturing process management module includes all process information of affecting the final remanufacturing product quality.
Through effect factors analysis and comparison of the remanufacturing product quality, you can find the key processes; key influencing factors and the optimal level combination by fully use of fishbone diagrams, Pareto, and multivariate analysis tools, in accordance with this combination, so as to achieve the stability improvement of product quality[8]. 3）Quality tool integration module provides a variety of quality tools to support process improvement.