Paper Titles

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone
p.1

Study on the Subsurface Damage of Single Crystal MgO Substrates
p.7

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
p.13

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels
p.18

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters
p.24

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool
p.30

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Study on the Subsurface Damage of Single Crystal...

Study on the Subsurface Damage of Single Crystal MgO Substrates

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Abstract:

Single crystal MgO can be used as the substrates to deposit HTS films. The subsurface damage (SSD) generated in processing has great effect on the strength and performance of the substrates. However, the characteristics of MgO SSD and its formation mechanism have not been understood fully. In this paper, the surface and subsurface damage caused by saw cutting, rough lapping and fine lapping of MgO substrates were studied by cross-section of microscopy and SEM. The formation mechanism was discussed; and a SSD model was presented.

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Advances in Abrasive Technology XI

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Periodical:

Key Engineering Materials (Volumes 389-390)

Pages:

7-12

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.389-390.7

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Online since:

September 2008

Authors:

Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia

Keywords:

Cross-Section, Dislocation, Microcrack, Single Crystal MgO, Slip, Subsurface Damage

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© 2009 Trans Tech Publications Ltd. All Rights Reserved

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