Paper Titles
Comparative Photocatalytic Study of TiO2 Coatings on Al Fiber
p.15
Fabrication of Carbon Aerogels
p.19
Hydrothermal Synthesis and Structure Characterization of Nanocrystalline Barium Titanate Powders
p.23
Sintering Behavior and Mechanism of Pure BaTiO3 Ceramic Prepared by High-Gravity Reactive Precipitation
p.27
Thermal Shock Testing of Ceramics for Circuit Substrates
p.31
Thermal Shock Test for Porous Ceramics Using Water Flow Cooling Method
p.35
Relation between Porosity and Permeability of Ceramic Membrane Supports
p.39
Structural Chemistry of Alkaline Earth Aluminate Phosphors
p.43
Normal and Abnormal Grain Growth in Ceramics - NbC-Co and Alumina
p.47

Thermal Shock Testing of Ceramics for Circuit Substrates

Article Preview

Abstract:

Thermal shock resistances of commercially available aluminum nitride and alumina ceramics as used for the circuit substrate were evaluated by infrared radiation heating (IRH) technique. Thermal shock fracture toughness, R2c of these materials was estimated experimentally and theoretically using IRH technique at various ambient temperatures. Temperature dependence of thermal properties of the materials was taken into account for the temperature and the thermal stress analysis. Experimental values of thermal shock fracture toughness were in good agreement with the calculated values. Thermal shock fracture toughness decreased with elevated ambient temperature in both ceramics.

You might also be interested in these eBooks
AICAM 2005 View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 11-12)

Pages:

31-34

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.11-12.31

Citation:

Cite this paper

Online since:

February 2006

Authors:

Sawao Honda, Shinobu Hashimoto, Hideo Awaji

Keywords:

Aluminum (Al), Aluminum Nitride (AlN), Temperature Dependence, Thermal Conductivity (TC), Thermal Shock Resistance

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2006 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] K. Watari: J. Ceram. Soc. Jpn. Vol. 109 (2001), p. S7.

Google Scholar

[2] K. Watari, H. Nakano, K. Urabe, K. Ishizaki, S. Cao and K. Mori: J. Mater. Res. Vol. 11 (2002), p.2940.

Google Scholar

[3] H. Nakano, K. Watari, H. Hayashi and K. Urabe: J. Am. Ceram. Soc. Vol. 85 (2002), p.3093.

Google Scholar

[4] H. Awaji and T. Endo: J. Ceram. Soc. Jpn. Vol. 103 (1995), p.960.

Google Scholar

[5] H. Awaji, S. Honda and T. Nishikawa: JSME Int. J. Vol. A40 (1997), p.414.

Google Scholar

[6] S. Honda, T. Nishikawa, H. Awaji, Y. Akimune and N. Hirosaki: Ceram. Trans. Vol. 133 (2002), p.127.

Google Scholar

[7] S. Honda, H. Tanaka and H. Awaji: Key Eng. Mater. (2005), in press.

Google Scholar

[8] H. Awaji and Y. Sakaida: J. Am. Ceram. Soc. Vol. 73 (1990), p.3522.

Google Scholar

[9] W.D. Kingery: J. Am. Ceram. Soc. Vol. 38 (1955), p.2.

Google Scholar

[10] D.P.H. Hasselman: J. Am. Ceram. Soc. Vol. 52 (1969), p.600.

Google Scholar