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Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method

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Abstract:

Interfacial residual stresses play an important role in the mechanical properties. In this paper, the interfacial residual stresses of SCI/Epoxy composites were determined using a novel technique-microphotoelastic method. The thermal residual stress field was also numerically simulated using a finite element software MSC.MARC. The difference and the similarities between the experimental results and the simulation of FEM analysis were discussed and the availability of the method was preliminarily certified.

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Periodical:

Key Engineering Materials (Volumes 326-328)

Pages:

273-276

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.326-328.273

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Online since:

December 2006

Authors:

Xin Wei Yang, Xin Hua Ji, Yong Ming Xing, Yu Wen Qin

Keywords:

Composite, Finite Element (FE) Simulation, Thermal Residual Stress

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

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