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MEMS R&D Trends
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MEMS R&D Trends

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Abstract:

Micro-Electromechanical Systems (MEMS) has been regarded as one of the most promising technologies for the 21st Century. Recently, some highlight areas attract great attention including Inertial MEMS, Optic MEMS, RF MEMS, BioMEMS, Power MEMS, and NEMS. The state of arts on MEMS research in China is briefly introduced and research activities in Northwestern Polytechnical University such as MEMS CAD tool, inertial MEMS devices, flexible substrate for MEMS integration, micro mirror, micro battery and three dimension measurement are demonstrated.

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Periodical:

Materials Science Forum (Volumes 532-533)

Pages:

181-184

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.532-533.181

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Online since:

December 2006

Authors:

Cheng Yu Jiang, Yang He, Wei Zheng Yuan

Keywords:

Inertial MEMS, MEMS CAD, Optical MEMS, Power MEMS

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] B. Neil, S. George: IEEE Sensors Journal, Vol. 1 (2001) No. 4, pp.332-339.

Google Scholar

[2] H. Fujita, H. Toshiyoshi: IEICE Transactions on Electronics, Vol. E83-C (2000) No. 9, pp.1427-1434.

Google Scholar

[3] S. Lucyszyn: IEEE Proceedings, Science, Measurement and Technology, Vol. 151 (2004) No. 2, pp.93-103.

Google Scholar

[4] M. Madou, C. Gurtner: Device Research Conference, 60th DRC. Conference Digest, 2002, pp.17-20.

Google Scholar

[5] S.A. Jacobson and A.H. Epstein: The International Symposium on Micro-Mechanical Engineering, (2003), pp.513-520.

Google Scholar

[6] A. White: A Review of Some Current Research in Microelectromechanical Systems (MEMS) with Defence Applications, (2002), pp.1-67.

Google Scholar