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Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics

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Abstract:

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

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Periodical:

Materials Science Forum (Volumes 532-533)

Pages:

357-360

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.532-533.357

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Online since:

December 2006

Authors:

Ying Chun Liang, De Gang Li, Qing Shun Bai, Yu Lan Tang

Keywords:

Molecular Dynamic (MD), Nanocutting, Parallel Calculation, Simulation

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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