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Isothermal Aging Effects on the Microstructure, IMC and Strength of SnAgCu/Cu Solder Joint
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A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates
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Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions
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Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment
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Shape Prediction and Reliability Design of Ball Grid Array Solder Joints
p.2944
Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules
p.2948
Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules
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Threshold Current Density of Electromigration Damage in Angled Polycrystalline Line
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Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue
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Shape Prediction and Reliability Design of Ball Grid Array Solder Joints

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Abstract:

Reliability optimization design of Ball Grid Array (BGA) solder joints is a major concern in area array electronics packaging technology. In this paper, shapes of the solder joints and their reliability were predicted and analyzed. Through the variations of lower pads’ diameters, the shapes of full array BGA solder joints with different solder volumes were predicted by using surface evolver software. Based on the results of shape prediction, 3-D finite element models were established with MSC.MARC and the distribution of the stress and strain in the BGA solder joints under thermal cyclic loading were simulated. Finally, fatigue lives of the BGA solder joints with different solder volumes were calculated, and the diameter ratios of lower pad to upper pad for these two kinds of BGA assemblies with the best reliability were optimized.

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Periodical:

Key Engineering Materials (Volumes 353-358)

Pages:

2944-2947

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.353-358.2944

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Cite this paper

Online since:

September 2007

Authors:

Yan Hong Tian, Chun Qing Wang

Keywords:

BGA, Fatigue Life, Finite Element Analysis (FEA), Reliability, Solder Joint

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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References

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