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Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability

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Periodical:

Materials Science Forum (Volume 439)

Pages:

12-17

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.439.12

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Online since:

November 2003

Authors:

Jong Min Kim, Young Eui Shin, Kozo Fujimoto

Keywords:

Lead-Free, Low Process Temperature, Micro-Electromechanical System (MEMS), Micro-Opto-Electro-Mechanical- Systems MOEMS, Optoelectronic Multichip Modules OE-MCMs, Self-Alignment

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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