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Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

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Abstract:

In the present work, we investigated the interfacial reactions and shear properties between Sn-3.0Ag-0.5Cu flip chip solder bump and Cu UBM after multiple reflows. The quantitative analyses of the intermetallic compound layer thickness as a function of the number of reflows were performed. After six reflows, the reaction product could be distinguished by two intermetallic compounds: Cu3Sn adjacent to the substrate and Cu6Sn5 which was the dominant phase. The thickness of total intermetallic compound layers increased with the number of reflows. The shear strength value did not significantly change as a function of the number of reflows. Nearly all of the test specimens showed ductile failure mode, and this could be well explained with the results of FEM analyses.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

863-868

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.863

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Online since:

November 2005

Authors:

Dae Gon Kim, Hyung Sun Jang, Jong Woong Kim, Seung Boo Jung

Keywords:

Flip Chip, Interfacial Reaction, Intermetallic Compound (IMC), Pb-Free Solder, Shear Strength

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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