Paper Title
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Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Dong Ming Guo, Ren Ke Kang
Abstract:Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer. The nonuniformity of...
119
Authors: Chi Xu, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin, Feng Wei Huo
Abstract:Chemical mechanical polishing (CMP) has been extensively used in the integrate circuit (IC) manufacturing industry as a widely accepted...
125
Authors: Cong Rong Zhu, Bing Hai Lv, Ju Long Yuan
Abstract:Studies on chemical mechanical polishing (CMP) for silicon nitride (Si3N4) balls with CeO2 abrasive carried to investigate the mechanism of...
131
Authors: Y. Chen, X. Wang, C.J. Zhang
Abstract:It is very difficult matter that polishes the internal surface of the pipe, especially to the thin pipe with the traditional surface...
137
Authors: Ju Long Yuan, Li Tao, Zhi Wei Wang, Qian Fa Deng, Feng Chen, Ping Zhao
Abstract:The amorphous Ni-Pd-P alloy films with superior property have good heat conductivity and wear performance. They are widely used in the...
141
Authors: Zhao Zhong Zhou, Ju Long Yuan, Bing Hai Lv, Jia Jin Zheng
Abstract:To study the sphere-shaping mechanism under dual rotating plates (DRP) lapping mode for ceramic balls, the uniformity of lapping trace...
147
Authors: Qiu Sheng Yan, Ai Jun Tang, Jia Bin Lu, Wei Qiang Gao
Abstract:A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented...
155
Authors: Ju Long Yuan, Dong Qiang Yu, Zhi Wei Wang, Yi Yang, Miao Qian, Bing Hai Lv
Abstract:The semibonded abrasive machining technique is expected to get high surface integrity and processing efficiency attributed to the „trap‟...
161
Authors: Yu Li Sun, Dun Wen Zuo, Yong Wei Zhu, Ming Wang, H.Y. Wang, Li Gang Zhao
Abstract:The friction behavior of single silicon wafer sliding against different ice counterparts (α-Al2O3, CeO2 and SiO2) at 10±0.5 °C within a...
167
Authors: Ju Long Yuan, Yi Yang, Zhi Wei Wang, Dong Qiang Yu, Miao Qian, Yong Dai
Abstract:This work aims to obtain fine surface of silicon wafer during precision and ultra precision machining, and presents a new method called...
173
Showing 21 to 30 of 71 Paper Titles