HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by author: Hae Do Jeong

• A Study of Micro-Tool Machining Using Electrolytic In-Process Dressing and an Evaluation of its Characteristics
  Published in: Advances in Abrasive Technology V (p35)
• A Study of Nano-Polishing of Injection Molds Using a Fixed Abrasive Pad
  Published in: Advances in Abrasive Technology V (p247)
• A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
  Published in: Advances in Abrasive Technology VI (p413)
• A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction
  Published in: Advances in Abrasive Technology VI (p459)
• Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)
  Published in: Silicon Carbide and Related Materials 2007 (p831)
• Electro-Chemical Mechanical Deposition for Planarization of Cu Interconnect
  Published in: Experimental Mechanics in Nano and Biotechnology (p389)
• Experimental Analysis in Lithium Niobate CMP for Room Temperature Bonding
  Published in: Eco-Materials Processing and Design IX (p129)
• Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results
  Published in: Advances in Abrasive Technology V (p229)
• Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing
  Published in: Advances in Abrasive Technology VI (p383)
• Replication for Microstructure Using Soft Mold
  Published in: Progress of Precision Engineering and Nano Technology (p348)
• The Characteristics of Frictional Behaviour in CMP Using an Integrated Monitoring System
  Published in: Progress of Precision Engineering and Nano Technology (p152)
• The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate
  Published in: Eco-Materials Processing and Design IX (p133)
• The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p367)
• The Effect of Slurry Composition and Flatness on Sub-Surface Damage and Removal in Chemical Mechanical Polishing of 6H-SiC
  Published in: Silicon Carbide and Related Materials 2008 (p605)
• Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns
  Published in: Eco-Materials Processing and Design IX (p117)