Papers by Author: Hirotaka Yamaguchi

Abstract: We investigated the effect of the basal plane dislocation (BPD) density in 4H-silicon carbide (SiC) substrates on the forward voltage (V_sd) degradation of body-diodes. Using reflection X-ray topography, the BPD density was automatically estimated from the substrates prior to fabrication of metal–oxide–semiconductor field-effect transistors (MOSFETs). A strong positive correlation was found between the V_sd shift, which was calculated from the difference before and after forward bias stress at 160 A/cm² for ~500 hours, and the BPD density of the substrate. We show that it is possible to predict V_sd shifts from the BPD densities of SiC substrates prior to the fabrication of MOSFETs. In addition, we examined the origin of stacking faults (SFs) as a result of the application of forward bias stress. We presume that SFs are formed by BPDs converted to threading edge dislocations at the epi/sub interface, as well as by BPDs penetrating into the epitaxial layer.

Abstract: Surface defects with scratch-like appearances are often observed locally on 4H-SiC wafers after epitaxial growth. We evaluated such damaged layer which is the cause of local step bunching using Mirror Projection Microscope (MPJ). As a result, MPJ can be detected l damaged layer which could not be detected using Synchrotron X-ray topography, even if these defects are extremely flat surface, no morphology, damaged layer is used to exist on the subsurface region. Thus, MPJ can be detected dislocation loops on the subsurface region of damage, it is effective to elucidate damaged layer of polishing process, MPJ is to be one of the candidates for inspection techniques of the damaged layer at substrate surface.

Abstract: The defect evolution on 90 μm-thick heavily Al-doped 4H-SiC epilayers with Al doping level higher than 10²⁰ cm^-3 was studied by tracing back to initial growth stage to monitor major dislocations and their propagations in each growth stage. Results from X-ray topography and KOH etching demonstrate that all existing dislocations on the surface of 90 μm-thick epilayer can be identified as the defects originating from substrate. In other words, there seems no new dislocation generated after a long-term growth. Nevertheless, a high density of misfit dislocation was found appearing near the substrate/epilayer interface for epilayer with Al doping level of 3.5×10²⁰ cm^-3, while misfit dislocation cannot be seen on epilayer with Al doping level of 1.5×10²⁰ cm^-3.

Abstract: We have investigated a conversion of basal plane dislocation (BPD) to threading edge dislocation (TED) in growth of epitaxial layers (epi-layers) on 4H-SiC vicinal substrates with an off-angle of 0.85° at low C/Si ratio of 0.7 by using deep KOH etching and X-ray topography observations. Deep KOH etching indicated that BPDs in the substrates converted to TEDs in the epi-layers. X-ray topography observations suggested that the conversion occurred during epitaxial growth when the thickness of epi-layers was less than 1.5 μm. We found that the conversion ratio obtained from counting deep KOH etch pits was over 99%.

Abstract: The causes of extrinsic failures in time-dependent dielectric breakdown characteristics of gate oxide on C-face of 4H-SiC are examined by comparing breakdown points of tested gate oxides with the images of X-ray topography and those of differential interference contrast microscopy. We have concluded as follows: (1) surface morphological defects that originate from threading screw dislocations degrade reliability of gate oxides. (2) These surface defects are not necessarily found on every wafer. (3) Crystallographic defects are not killer defects of MOSFET per se.

Abstract: The breakdown failure points in the 4H-SiC PiN diodes were analyzed by the electron beam induced current (EBIC). We focused on the failure, which showed the avalanche breakdown, and we determined the failure points by an emission microscopy. We observed the basal plane dislocation around the failure point and at measured temperatures below 200K we found the dark spots in the EBIC. However, in the X-ray topography image, no spots were found around the dislocations. We therefore think that these spots originated from the metal contamination. The electric field was multiplied due to a permittivity change, and this multiplication caused the avalanche breakdown.

Abstract: We have fabricated the four pn-type junction TEGs (Test Element Groups) having different structure. Those TEGs are close to the double-implanted (Di) MOSFETs, step by step from the simple pn diode. Voltage-current (V-I) characteristics of the hundred TEGs having p-well structure show similar blocking characteristics of those of simple pn diodes on the same wafer. This indicates that the p-well structure itself does not cause a significant deterioration on the blocking yield. On the other hand, the yield is significantly influenced by the annealing condition for ion-implanted layer. The oxide-related hard breakdown on the JFET region dominates the blocking yield. The reach-through breakdown of the TEGs having the n+ region within each p-well becomes largely suppressed by the high-temperature and short-time annealing.

Abstract: This paper describes the study of non-hollow-core elementary screw dislocations (SDs) in silicon carbide (SiC) diodes using X-ray microbeam three-dimensional topography. Strain analysis shows that typical screw dislocations having a symmetric strain field tend to cause microplasma breakdown, whereas deformed SDs do not. The symmetry break in SDs will relax the focussing of strain and lessen the formation of defects, thereby leading to the desirable non-leak property.

Abstract: The SiO2/4H-SiC hetero-interface was observed using TEM in plan-view geometry. Local roughening of the SiO2/4H-SiC hetero-interface accompanied with local generation of basal-plane dislocations in SiC was observed. In some places, local variations in film thickness of SiO2 as well as the presence of extra carbon and particle-like contrast asociated with the generation of basal-plane dislocations in SiC was observed. The influence of these defect regions on MOSFET properties is discussed.

Abstract: Dislocations in a substrate wafer of 4H-SiC with an epi-layer were observed using technique of monochromatic synchrotron X-ray topography in a grazing incidence geometry. Six different Burgers vectors of basal plane dislocations and threading edge dislocations were identified by changing the Bragg reflections, and by analysis of images of dislocation. We identify some relations of the Burgers vector and the dislocation contrast observed for g=11 2 8. Some of these relationships are discussed in this report.