Papers by Author: Hiroyuki Yaguchi

Abstract: Though the crystal growth technology of SiC is improving steadily, it is still crucial to reduce crystalline defects which act as carrier recombination (CR) centers and deteriorate device performance. We detected CR centers in a p-type 4H-SiC substrate by observing the intensity change of photoluminescence due to the addition of a below-gap excitation (BGE) light of 0.93[eV]. We noticed the temperature and the BGE density dependence of band edge (BE) emission in addition to donor acceptor pair (DAP) emission and discriminated the temperature effect from that of BGE. The BGE density dependence of the PL intensity quenching is different among the BE emission, B₀- and C₀-lines of the DAP, respectively. It gives us an important clue for understanding CR mechanisms inside the bandgap of SiC.

Abstract: We performed real-time observations of SiC oxidation at various temperatures by in-situ spectroscopic ellipsometry using a Si-face, an a-face and a C-face substrates. We calculated oxide growth rates based on “Si-C emission model,” taking into account the emission of interfacial Si and C atoms from the SiC–SiO₂ interface. The calculated values well reproduced the oxide thickness dependence of oxide growth rates. We discussed the SiC oxidation mechanism using the parameters deduced from the calculations.

Abstract: We have investigated the effect of thermal oxidation on stacking faults (SFs) in 4H-SiC epilayers using photoluminescence imaging. We found that a comb-shaped dislocation array was deformed by thermal oxidation and that SFs were formed on both sides of the comb-shaped dislocation array by a laser irradiation. Transmission electron microscopy has been performed in the comb-shaped dislocation array to observe the stacking pattern of SF near the dislocation. As a result, the SF turned out to be a single Shockley SF (1SSF). We also found that line-shaped faults perpendicular to the off-cut direction were formed during oxidation and were stretched with oxidation time. Moreover, triangle-shaped SFs were formed/expanded from the line-shaped faults by a laser irradiation. The characteristics of these line-shaped faults were discussed.

Abstract: To verify the Si emission phenomenon during oxidation of SiC, the behavior of Si atoms was investigated using HfO₂/SiC structures. At low oxygen pressure, i.e. the oxidation condition predominant to active oxidation, Si emission into oxide layer and the growth of SiO₂ on the oxide surface were clearly observed by TOF-SIMS. On the other hand, the growth of SiO₂ on the surface was suppressed under an ordinary pressure. These results evidence the Si emission during oxidation that is proposed in the Si and C emission model.

Abstract: We found that the ‘Si and C emission model’ that we proposed as an oxidation model of SiC could not reproduce the initial oxide growth rates of SiC at sub-atmospheric pressures. The comparison between calculated and observed growth rates suggests that the oxide growth on the oxide surface is enhanced in the initial oxidation stage and thus our oxidation model is inaccurate in the description on the surface oxidation. Accordingly, we reconsidered the parameters on surface oxidation and, as a result, found that a much enlarged oxygen concentration on the oxide surface is necessary for solving the discrepancy between calculated and observed growth rates.

Abstract: We have studied the properties of photoluminescence (PL) from individual isoelectronic traps formed by nitrogen-nitrogen (NN) pairs in nitrogen atomic-layer doped (ALD) GaAs. Micro-PL measurements were performed to investigate the properties of single photons generated from individual isoelectronic traps. Twin PL peaks were observed from individual isoelectronic traps in nitrogen ALD GaAs (001). The PL transitions at longer and shorter wavelength sides were linearly polarized in the [110] and [1-10] directions, respectively. The peak splitting and polarization properties can be explained by some in-plane anisotropy most likely due to strain in host crystal. From individual isoelectronic traps in nitrogen ALD GaAs (111), a single PL peak with random polarization was observed, showing that the growth on (111) surface is an effective way to obtain unpolarized single photons. As for nitrogen ALD GaAs (110), different polarization properties were obtained depending on the atomic configuration of NN pairs. In addition, we have used AlGaAs layers to diminish the in-plane anisotropy and could successfully obtained single emission lines with unpolarized character. Introducing AlGaAs layers was also useful for improving the luminescence efficiency.

Abstract: To understand the structure of SiC–oxide interface more in detail, we propose a profiling theory of Si and C emission into SiC layer during oxidation. Simulations of the depth profiles of Si and C interstitials results in the structures analogous with those observed from a spectroscopic ellipsometry. To determine the diffusivities of Si and C interstitials, we performed capacitance–voltage measurements for examining the re-distribution profiles of nitrogen after oxidation and compared between observed and calculated profile. The calculated nitrogen profiles showed good fits to the observed ones in the case of self-diffusivity of C interstitials magnified by several 10 times for literature value. Finally, we discuss the validity of the proposed theory.

Abstract: We have investigated the oxidation process of SiC (000-1) C-face at low oxygen partial pressures using an in-situ spectroscopic ellipsometry. The oxide growth rate decreased steeply at the early stage of oxidation and then slowly decreased with increasing oxide thickness. The initial oxide growth rate was almost proportional to the oxygen　partial　pressure for both the polar directions. This result suggests that the initial interfacial reaction rate is constant regardless of the concentration of oxidants reaching the interface.

Abstract: We have tried to apply the oxidation model of SiC proposed previously, termed ‘Si-C emission model’, to the oxide growth rate at various oxidation temperatures. We have found that the model well reproduces the oxide thickness dependences of oxide growth rates for all of the temperatures measured for both of the SiC Si- and C-faces. We have estimated the temperature dependence of oxide depth profiles of Si and C interstitials by using the Si-C emission model, and discussed the structure at/near the SiC–oxide interface.

Abstract: Thermal oxidation process of silicon carbide in ultra-thin oxide regime has been studied by performing in-situ and real time spectroscopic ellipsometry. We found the thermal oxidation at 700°C forms no or extremely thin interface layers between SiC and oxide layers. In contrast, the oxidation at 850°C forms an interface layer of around 1 nm in thickness, having similar thickness and optical constants of the interface layers formed by the oxidation at higher temperature than 1000°C. To make clear the conditions no interface layer is formed, i.e., whether low temperature growth or thin oxide thickness is crucial, we have performed the oxidation at 850°C in the reduced oxygen pressure. Based on the results of these experiments, we discussed the origin of the formation of interface layers as well as the oxidation mechanism of SiC.