Papers by Author: Jong Min Kim

Abstract: In recent years, the replacement repair welding, through which damaged bridges are repaired by replacing of the damaged sections with new steel plates through cutting and welding under in-service conditions, has been highlighted for its brilliant features i.e. it can be achieved without incurring traffic dislocation. However, the validity of the repair method is not fully verified because of its lack of safety and reliability. Moreover, repair method by welding inevitably involves cutting and welding process, and the weldability of the replacement repair welded joints has not yet been clarified. In this paper, the weldability of the replacement-repair-welded joints was investigated in order to improve reliability in the repair welded joints of the aged steel bridge. A Steel plate was extracted from the steel bridge after the period of prolonged service, and was welded with a new plate, using replacement repair welding technique, in order to construct a specimen. Flux Cored Arc Welding (FCAW) process was used to fabricate the double "V" butt joints. Welded joints were characterized on the basis of chemical composition analysis, hardness test and micro-structural analysis.

Abstract: The reliability of QFP (Quad flat package) solder joint using Sn-8Zn-3Bi solder paste under the thermal shock test was investigated. Considering the environmental restriction such as ROHS, the QFP Cu LF (Lead-frame) was coated with lead-free materials (Sn, Sn-3Bi). To analyze the reliability under thermal shock treatment, the samples were placed in the thermal shock chamber (248K/423K, Dwell time: 30min). During the thermal shock test, the solder joint cross-sections were observed every 500 cycles. No crack initiation and propagation was observed through all type of plated Cu LF. The measured pull strength slightly decreased, as the number of cycles increased. After 1000 cycles, the pull strength of Sn and SnBi plated Cu LF reduced by 30% and 20%, respectively, compared with that of initial condition. Observing the fracture surface morphology by FE-SEM, the fracture mode changed and the IMC fractured area on the both fracture surface was increased. The IMC was identified as γ-Cu5Zn8 by chemical composition analysis using EDS. The reduced pull strength was affected by IMC fracture and fracture mode change. However, the pull strength does not decrease steeply but gradually. Consequently, the Sn-8Zn-3Bi solder joint shows the reliable solder joint strength, fracture mechanism, and compatibility with lead-free plated Cu LF during the thermal shock temperature of 248K to 423K.

Abstract: A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders on two kinds of metals were investigated using an optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24º.

Abstract: A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.

Abstract: The ultimate goals of this study are to investigate numerically nonequilibrium energy transfer between electrons and phonons, and to predict the crater formation shapes of gold thin film structures irradiated by femtosecond pulse lasers. In particular, the present article expands the onedimensional two-temperature model (1DTTM) to the two-dimensional model (2DTTM) considering wave interference, and it involves the quantum effect to predict thermal and optical properties. The predictions by using 2DTTM are extensively compared with those of 1DTTM, and the influence of film thickness on radiation heat transfer and optical characteristics are also examined. From the results, it is found that the predictions of 2DTTM are in good agreement with those of 1DTTM. As the gold film thickness decreases, the reflectivity decreases dramatically and the absorbed laser intensities at the top surface increases substantially because of wave interference in thin films.