Papers by Author: Karl D. Hobart

Abstract: Graphene, a 2D material, has motivated significant research in the study of its in-plane charge carrier transport in order to understand and exploit its unique physical and electrical properties. The vertical graphene-semiconductor system, however, also presents opportunities for unique devices, yet there have been few attempts to understand the properties of carrier transport through the graphene sheet into an underlying substrate. In this work, we investigate the epitaxial graphene/4H-SiC system, studying both p and n-type SiC substrates with varying doping levels in order to better understand this vertical heterojunction.

Abstract: Shockley stacking fault (SSF) contraction in 4H-SiC was investigated, in-situ, under varying temperature and ultraviolet (UV) intensity. Contraction of single SSFs at room temperature was observed for the first time under low power UV excitation of 0.04 W/cm². At temperatures above 150 °C, complete SSF contraction occurred for UV power at 0.2 W/cm². In contrast to expansion, SSF contraction occurred in discrete jumps between pinning sites along existing C-core partials. Luminescence from the pinning sites suggest they may be local concentrations of point defects. Additionally, a change in the line direction of the Si-core partials by ~25o off the direction was observed.

Abstract: Integration of patterned ballast resistance into the anode of SiC PiNs is a solution to the dilemma of negative dV_f /dT for such diodes. In fabricated 4H-SiC PiN diodes, we demonstrate a cross-over from negative to positive temperature coefficient for current densities as low as 80 A/cm². Adjusting the percentage of the patterned anode area, the positive or neutral dV_f /dT can be achieved over a wide current-density range without substantial penalty in the forward voltage drop. This characteristic is crucial for high-power SiC packages with ganged-parallel rectifier arrays.

Abstract: The performance of Junction Barrier Schottky (JBS) diodes developed for medium voltage hard-switched Naval power conversion is reported. Nominally 60 A, 4.5kV rated JBS freewheeling diodes were paired with similarly rated Si IGBTs and evaluated for temperature dependent static and dynamic characteristics as well as HTRB and surge capability. The SiC JBS/Si IGBT pair was also directly compared to Si PiN diode/Si IGBT with similar ratings. Compared to Si, the SiC freewheeling diode produced over twenty times lower reverse recovery charge leading to approximately a factor-of-four-reduction in turn-on loss. Alternatively, for equivalent total switching loss, the SiC JBS/Si IGBT hybrid configuration allows for at least a 50% increase in specific switched power density. Reliability testing showed the devices to be robust with zero failures.

Abstract: Homo- and heteroepitaxial 3C-SiC layers were grown on 4H-SiC step-free mesas. The yields of smooth, defect-free mesas were ~ 17% for both intentionally and unintentionally doped films, while those with screw dislocations and multiple stepped surfaces were ~ 22%. The electronic and structural properties of the mesas were found on a micrometer-sized length scale using µ-PL and µ-Raman, respectively. 3C-SiC mesas were found to have complete 3C-SiC coverage with some of the mesas having electronic defects, while other mesas were found to be defect-free.

Abstract: Field-effect transistors were fabricated on GaN and Al0.2Ga0.8N epitaxial layers grown by metal organic chemical vapor deposition (MOCVD) on sapphire substrates. The threshold voltage VTH was higher when AlGaN was used as an active layer. VTH also increased with temperature due to the increased positive polarization charge at the GaN/AlN buffer/sapphire interfaces. Drain current increased at high temperatures even with more positive threshold voltage, which makes GaN-based FET devices attractive for high temperature operation.

Abstract: Epitaxial graphene (EG) grown on the carbon-face of SiC has been shown to exhibit high carrier mobilities, in comparison to other growth techniques amenable to wafer-scale graphene fabrication. The transfer of large area (>mm2) graphene films to substrates amenable for specific applications is desirable. We demonstrate the dry transfer of EG from the C-face of 4H-SiC onto SiO2, GaN and Al2O3 substrates via two approaches using either 1) thermal release tape or 2) a spin-on, chemically-etchable dielectric. We will report on the impact that these transfer processes has upon the electrical properties of the transferred EG films.

Abstract: Nanocrystalline diamond (NCD) films were deposited using plasma-enhanced chemical vapor deposition. The NCD films were Boron-doped for p-type conductivity, yielding sheet resistances from 6.17x1011 to 522.5 /. Four different metals were deposited as Ohmic contacts and investigated for contact resistance and thermal stability. Contact and film annealing was performed under different atmospheric conditions with variable N2 content.

Abstract: Since it was determined that the formation and expansion of intrinsic stacking faults (SFs) induced a drift in the forward voltage (Vf) in 4H-SiC bipolar devices, significant effort has been made to understand the driving force causing SF motion as well as the various associated luminescence processes. The observation that annealing of faulted SiC devices and epilayers induced SF contraction and a recovery of the Vf drift enabled the studying of the impact of various parameters such as temperature, injection level and operation time upon SF motion, the Vf drift and luminescence within the same device. However, these observations in many cases contradicted the previously reported driving force models. Here we report on a basic driving force model explaining SF expansion in hexagonal SiC as well as discuss the observation of green luminescence from C-core partial dislocations bounding the SFs that may indicate an enhanced mobility of point defects within forward biased SiC pin diodes.

Abstract: Thermally stimulated current (TSC) measurements on epitaxial and implanted 4H-SiC MOS capacitors are presented. The effect of gamma ray irradiation on the TSC spectra of epitaxial 4H-SiC MOSCAP devices is discussed. On non-irradiated samples, two TSC peaks are observed near 55 K and 80 K. Due to the generated oxide charge during irradiation, the 80 K emission split into two constituent peaks. These have been attributed to hole traps and Al acceptors.