Papers by Author: Norihiro Hoshino

Abstract: We demonstrated the rapid and nondestructive observation of structural defects in SiC wafers by full-wafer photoluminescence (PL) imaging under below-gap excitation. The use of visible light emitting diode arrays as an excitation source is essential to the simplification of an optical system and the light excitation covering the whole wafer. We were able to observe the defect-related intensity patterns similar to those obtained by conventional laser-scanning PL mapping. The measurement time of the PL imaging was more than fifty times faster than that of the PL mapping.

Abstract: We investigated the expansion of single Shockley stacking faults (SSFs) in a 4H-SiC epitaxial layer under high-intensity scanning laser beam during room temperature photoluminescence mapping, which is similar to the degradation of bipolar pin diodes during forward current injection. In an epitaxial layer on an 8 off-axis (0001) substrate, the SSF-related intensity patterns induced by scanning high-intensity laser beam were classified into two types. The first one was a triangular pattern and the second a pattern which expanded in accordance with the motion of the scanning laser beam. The origins of the SSFs responsible for both patterns are presumably due to the preexisting basal plane dislocations and the dislocation-loops on the basal plane in the epitaxial layer, respectively. On the other hand, most of the SSF-expansion in on-axis (11 2 0) epitaxial layers were similar to the second type in the (0001) epitaxial layer. We, therefore, suggest that the dislocation-loops, which were located close to the surface, were dominant nucleation-sites of the SSFs in the (11 2 0) epitaxial layers.

Abstract: The advantage of room-temperature photoluminescence (PL) mapping was demonstrated for nondestructive detection of stacking faults (SFs) in off-oriented 4H-SiC epitaxial and bulk wafers. In mapping of the SF-related emission at 2.9 eV on the wafers, the SFs in the surface region appeared as a bar-shaped pattern with the long side perpendicular to the off-cut direction. The use of 266 nm light excitation is essential to detect the SF pattern in the bulk wafers because of its shallow penetration depth. The dark lines crossing the bar-shaped patterns in the epitaxial wafers are ascribable to the basal plane dislocation located close to the SF-planes.