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Articles by author: U. Welzel

• In Situ X-Ray Diffraction Investigations during Diffusion Anneals of Ni-Cu Thin Film Diffusion Couples
  Published in: THERMEC 2009 Supplement (p503)
• An X-Ray Diffraction Method to Determine Stress at Constant Penetration/Information Depth
  Published in: Residual Stresses VII, ECRS7 (p13)
• Applicability of the Crystallite Group Method to Fibre Textured Specimens
  Published in: European Powder Diffraction EPDIC 8 (p131)
• Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
  Published in: Residual Stresses VI, ECRS6 (p691)
• Diffraction Stress Analysis Using Direction Dependent Grain-Interaction Models
  Published in: Residual Stresses VII, ICRS7 (p7)
• Interdiffusion and Stress Development in Thin Film Diffusion Couples
  Published in: Residual Stresses VII, ECRS7 (p801)
• Mechanical Stress Gradients in Thin Films Analyzed Employing X-Ray Diffraction Measurements at Constant Penetration/Information Depths
  Published in: Residual Stresses VII, ECRS7 (p19)
• Stress and Diffusion in Nb-W Bilayers
  Published in: Residual Stress ECRS 5 (p405)
• Stress Evolution in Thin Films; Diffusion and Reactions
  Published in: Diffusion and Stresses (p71)
• Stress in Thin Layers; Grain Interaction, Elastic Constants and Diffraction Response
  Published in: Residual Stress ECRS 5 (p42)