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Articles by author: Xue Feng Xu

• Bond Strength Analysis among Layers of Grinding Wheel
  Published in: Frontiers of Manufacturing and Design Science II (p38)
• Development of a Dicing Blade Using Light-Hardening Resin
  Published in: Advances in Abrasive Processes (p99)
• Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry
  Published in: Ultra-Precision Machining Technologies (p214)
• Preparation and its Silica Wafer CMP Performance of Cationic Polyelectrolyte Modified Benzoguanamine Formaldehyde/SiO₂ Composite Abrasives Slurry
  Published in: Manufacturing Process Technology (p4158)
• Study on Characterization of Cationic Polyelectrolyte Modified Benzoguanamine Formaldehyde/Silica Composite Abrasives Slurry
  Published in: Application of Diamond and Related Materials (p254)
• Study on Effect of Composite Particles in Polishing Process and Its Mechanism
  Published in: Precision Surface Finishing and Deburring Technology (p155)
• Study on the Inclusion Interactions of β-Cyclodextrin with Oleic Acid by Competitive Inclusion Method
  Published in: Mechanical and Electronics Engineering III (p847)
• The Fractal Distribution of SiO₂ Particles and Its Effect on the Tensile Strength of Photosensitive Resin Dicing Blade
  Published in: Advances in Grinding and Abrasive Processes (p59)
• The Mechanism of Polymer Particles in Silicon Wafer CMP
  Published in: Advances in Materials Manufacturing Science and Technology XIII Volume I (p231)