Papers by Author: Yaroslav Koshka

Abstract: 4H Silicon Carbide (4H-SiC) has a great potential for low-loss power devices due to its superior electrical properties. However, the increase in demand for the power devices requires high quality SiC substrates and epitaxial layers. Mercury probe Capacitance Voltage (Hg CV) measurement is a well known procedure to characterize epi layers grown on SiC substrates, due to its non-destructive technique. However, careful calibration of the tool is very important for repeatable and accurate measurements. Here we present very close repeatability of Hg CV within 2.4% (standard deviation 0.7%), between different Solid State Measurements (SSM) setups compared with Ni Schottky (NiS) CV. In addition to growing uniformly doped epi layers, high surface quality of the epi layer is also needed for improved device performance. Improved process conditions resulted in a smooth epi with a surface roughness Ra 1.2 nm for a 6 µm thick epi layer. Molten Potassium Hydroxide (KOH) etching analysis also revealed a significant correlation between the surface roughness and epi defects.

Abstract: Dislocations were investigated in the halo-carbon low-temperature epitaxial growth and low-temperature selective epitaxial growth (LTSEG) conducted at 13000C. The origin of triangular defects was investigated in low-temperature epilayers grown at higher growth rates with HCl addition. Due to the conversion of substrates’ basal plane dislocations (BPD) into threading dislocations, the concentration of BPDs was about an order of magnitude lower than the concentration of threading dislocations at moderate growth rates. An additional order of magnitude conversion of BPDs into threading dislocations was observed at higher grow rates achieved with HCl addition. In LTSEG epilayers, dislocation concentration away from the mesa walls was comparable to the blanket (i.e., regular non-selective) growth. High concentrations of BPDs were found only at mesa edges located on the “upstream” side with respect to the step-flow direction. No substrate defects could be traced to the triangular defects. Instead, the disturbances causing the triangular defect generation are introduced during the epitaxial process.

Abstract: Chlorinated silicon precursor SiCl4 was investigated as a source of additional chlorine instead of or in combination with HCl during the low temperature (13000C) halo-carbon epitaxial growth. No Si cluster cloud was visible inside the hot-wall susceptor indicating negligible homogeneous gas-phase nucleation. The growth rate was significantly enhanced compared to the SiH4-case, but was relatively close to the SiH4+HCl case. Similar to the SiH4+HCl growth, the increase of the growth rate caused by suppressed cluster formation was less significant than expected. The depletion of the growth species by vigorous polycrystalline deposition upstream of the hot zone, which was earlier reported for the SiH4+HCl growth, was also significant in the SiCl4-based growth. Closer to the growth zone, carbon species also get incorporated in the polycrystalline deposits.

Abstract: In this work, the local-loading effect and its influence on the growth rate enhancement and the growth rate non-homogeneity is investigated during the halo-carbon low-temperature selective epitaxial growth (LTSEG) using an SiO2 mask. The average growth rate during the LTSEG can be more than three-times higher than in blanket epitaxy at the same growth conditions. Both the size of the LTSEG seed windows and the surrounding area covered with the mask determine the growth rate non-homogeneity. A model for predicting the growth rate distribution is suggested.

Abstract: In this work, nitrogen doping was investigated during the low-temperature halo-carbon epitaxial growth of 4H-SiC on Si- and C-faces. The dependencies of nitrogen incorporation on nitrogen flow rate, Si/C ratio, growth rate, and temperature were investigated. It was established that the efficiency of nitrogen incorporation for the C-face growth at 1300 °C is higher than that for the Si-face for a wide range of the growth conditions. Seeming deviation of the Si/C ratio dependence from the “site-competition” trend confirmed the critical role of the silicon vapor condensation during the low-temperature epitaxy. Opposite trends for the nitrogen doping dependence on the growth rate were observed on the Si- and C-faces. Finally, a complex temperature dependence of the nitrogen doping in the temperature range from 1300 to 1450 0C was observed.

Abstract: The room-temperature photoluminescence (RTPL) was investigated in commercial nitrogen-doped 4H-SiC substrates. In a typical RTPL spectrum of n-type 4H-SiC substrate, the ‘band-edge’ emission was similar to PL signatures that are typically attributed to free-exciton recombination in high-quality thick epitaxial layers. The origin of the deep-defect ‘red’ emission and its influence on recombination properties of SiC remain unclear. In most of the substrates in which the ‘red’ RTPL band was strong, clear reverse correlation between the ‘red’ and ‘band-edge’ RTPL intensities was observed. In contrast, direct correlation was observed between the ‘bandedge’ PL map and distribution of the net free electron concentration. There is a possibility that incorporation of nitrogen donors is influenced by (or influences) incorporation of lifetime-limiting deep defects.

Abstract: Previously reported CVD epitaxial growth of 4H-SiC at temperatures down to and below 13000C using CH3Cl precursor offered a promise of new device applications that could benefit from lower-temperature growth process. In this work, selective epitaxial growth (SEG) of 4H-SiC mesas using conventional SiO2 low temperature mask is reported. Virtually no nucleation on the mask could be observed after SEG at 13000C. The mask could be easily removed after the growth, with no degradation of the surface of SiC substrate under the mask. For the growth conditions that normally resulted in growth rate of 2 /m/hr and defect-free epilayer morphology during regular full-wafer (non-SEG) epitaxy, the epilayer morphology during SEG was significantly degraded by the appearance of oriented triangular defects, while the growth rate increased more than three times in comparison to the blanket epitaxial growth due to the loading effect. The growth at optimized growth conditions and lower growth rate resulted in significant reduction of the surface defects, making this approach promising for obtaining device-quality mesas. The crystal quality of the mesas, defects at the mesa walls, formation of facets during SEG, and other effects are reported.

Abstract: Low-temperature epitaxial growth of 4H-SiC with CH3Cl carbon precursor was further developed. In-situ doping with nitrogen and aluminum was investigated. The nitrogen concentration in epitaxial layers grown on the C face was almost two orders of magnitude higher than that in the Si-face epilayers grown in the same growth run at 13000C. The opposite trend was observed for intentional aluminum doping, with more than an order of magnitude higher aluminum concentration incorporated in Si-face epilayers. High values of nitrogen and aluminum doping well in excess of 1020 cm-3 without any obvious epilayer morphology degradation can be achieved on C-face and Siface respectively. Addition of HCl during halo-carbon growth at 13000C resulted in drastic improvement of the surface morphology. Also, a significant increase of the growth rate took place confirming that the improvement in the epilayer morphology during HCl-assisted growth is predominantly related to silicon cluster etching by additional Cl-containing vapor species.

Abstract: Dielectric charges and charge stability were compared in different dielectrics formed on SiC by different processing techniques. The concentration and transient behavior of the interface and trapped charges were investigated. Strong hysteresis and flat-band voltage drift under applied bias were observed in some of the samples. They are attributed to the trapping of the charge injected in the dielectrics. Differences in charge injection, charge trapping, and capture/emission of carriers by interface traps were pronounced for the investigated SiO2 and Si3N4 dielectrics.

Abstract: A room temperature PL mapping technique was applied to establish the origin of resistivity variation in PVT-grown 6H SiC substrates. A direct correlation between the native defect-related PL and resistivity was found in undoped (V-free) samples. In vanadium-doped samples with low vanadium content, the resistivity showed a good correlation with the total PL signal consisting of contributions from both vanadium and native point defects. Well-known UD1 and UD3 levels were revealed by low-temperature PL spectroscopy. Some correlation was observed between these low-temperature PL signatures and the resistivity distribution.