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Articles by keyword: «Copper CMP»

• Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
  Published in: Advances in Abrasive Technology VI (p389)
• Corrosion Inhibaitors for Copper in Hydroxylamine-Based Chemistries Used for CMP and Post-CMP Cleaning
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p271)
• Non-Contact Cleaning Process for Post-CMP Copper
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p291)
• Research on Effects of Slurry Additives in Cu CMP for ULSI Manufacturing
  Published in: Advances in Grinding and Abrasive Technology XIII (p350)