Papers by Keyword: Dilute Sulfuric Peroxide DSP

Abstract: In this paper, a digital rebalance loop for MEMS gyroscope is designed and its performance test is performed. First, the system model of MEMS gyroscope is established by dynamic analysis. Then, the digital rebalance loop is designed using modern control technique. The performance of the digital rebalance loop is compared with that of conventional PID rebalance loop. Through frequency response analysis using MATLAB and experiments using a real MEMS gyroscope and digital controller, which is realized using digital signal processor (DSP), it is confirmed that the controller improves the performance of the gyroscope.

Abstract: Composite sandwich structures are finding increasingly widespread use in fields ranging from aerospace and wind turbines to sports applications such as skis and surfboards. The high specific stiffness that composite sandwich structures can provide lends them well to these applications. However, the operational environment of these structures is frequently aggressive and often results in damage during service. The extent and effect of damage incurred is an important factor in the design and maintenance of composite sandwich structures. Failure of an individual component can be catastrophic for the rest of the structure. The purpose of this investigation was, firstly, to ascertain whether DSP was a viable technique for determining strain fields within composite sandwich structures. Secondly, to determine whether four point flexure would give rise to pure flexure between the central rollers, and if not, to understand what load conditions were present. This investigation was also carried out with a view to extend the investigation into the effect of defects on composite sandwich structures manufactured by RIFT. The grounds for selection of composite sandwich structures normally lie in their flexural performance. Reliable and accurate quantitative testing methods for evaluating the flexural performance of sandwich panels are needed if composite sandwich structures are to be used safely and effectively. In addition, methods to determine the effect of damage and defects on flexural behaviour of sandwich structures is particularly important for designing the repair and maintenance regimes of composite sandwich components.

Abstract: A Post-Etch-Residue (PER) removal process for tank and spray tools has been developed using a new inorganic aqueous based chemistry. The performance of this new type of polymer remover, Inosolv 400 Fotopur®, on process wafers is compared with other inorganic chemistries such as DSP (Dilute Sulphuric acid hydrogen Peroxide) and DSP+, containing traces of HF. Inosolv 400 Fotopur® has improved polymer removal capabilities. Furthermore Inosolv 400 Fotopur® does not show any attack of the metal or dielectric layers and is inorganic based and thus environmentally friendly.