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Articles by keyword: «Ductile Mode Grinding»

• A Method for Grinding Mode Identification in Grinding of Silicon Wafers
  Published in: Precision Surface Finishing and Deburring Technology (p255)
• Effect of Cutting Edge Truncation on Ground Surface Morphology of Hard and Brittle Materials for Optical Devices
  Published in: Advances in Abrasive Technology VIII (p139)
• Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates
  Published in: Digital Design and Manufacturing Technology (p738)
• Optimization of Cutting-Edge Truncation in Ductile-Mode Grinding of Optical Glass
  Published in: Progress in Abrasive and Grinding Technology (p77)
• Subsurface Damage in Single Diamond Tool Machined SI Wafers
  Published in: Defects in Semiconductors 18 (p1841)
• Thrust Force Directional Vibration-Assisted Ductile-Mode Grinding of Single-Crystal Si
  Published in: Advances in Abrasive Technology XIII (p627)