Papers by Keyword: EBIC

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Abstract: It is shown that the X-ray beam induced current method (XBIC) can be realized at the laboratory X-ray source using the polycapillary x-ray optics. The images of iron contaminated grain boundaries in multicrystalline Si are obtained. It is shown that the grain boundary XBIC contrast is 2-3 times smaller than the EBIC one. A simulation of XBIC and EBIC contrast values for two-dimensional defects is carried out and a good correlation between the experimental and calculated values is obtained. The dependence of grain boundary XBIC contrast on the X-ray beam width is calculated.
226
Abstract: Germanium is an attractive model system for studying the crystallization mechanism and optimization of the growth processes in photovoltaics. In comparison to Si it has a lower melting point and that is why its usage is cost effective. The main aim of our work was to verify the similarities in the growth related defect formation between Ge and Si. We apply standard Si characterization methods to poly and VGF-grown n-type Ge. Room temperature and 80 K EBIC measurements were done to reveal the defect structure. Photoluminescence spectra were used to characterize the optical properties as for instance the Ge band-to-band or defect originated transitions. Additionally, photoluminescence and cathodoluminescence maps were preformed to reveal the defect distribution/activity, too, by using the direct Ge band-to-band transition.
483
Abstract: We report a dynamic and microscopic investigation of electrical stress induced defects in metal-oxide-semiconductor (MOS) devices with high-k gate dielectric by using electron-beam induced current (EBIC) technique. The correlation between time-dependent dielectric breakdown (TDDB) characteristics and EBIC imaging of breakdown sites are found. A systematic study was performed on pre-existing and electrical stress induced defects. Stress-induced defects are related to the formation of electron trapping defects. The origin of pre-existing defects is also discussed in terms of oxygen vacancy model with comparing different gate electrodes.
461
Abstract: We report on the optical and mechanical properties of Si3N4 inclusions, formed in the upper part of mc-Si blocks during the crystallization process. Those inclusions usually appear as crystalline hexagonal tubes or rods. Here we show that in many cases the Si3N4 inclusions contain crystalline Si in their core. The presence of the Si phase in the centre was proven by means of cathodoluminescence spectroscopy and imaging, electron beam induced current measurements and Raman spectroscopy. The crystalline Si3N4 phase was identified as β-Si3N4. Residual stress was revealed at the particles. While the stress is compressive in the Si material surrounding the Si3N4 particles tensile stress is found in the Si core. We assume that the stress is formed during cool down of the Si block and is a consequence of the larger thermal expansion coefficient of Si in comparison to that of β-Si3N4. Iron assisted nitridation of Si at temperatures below 1400 °C is considered a possible mechanism of Si3N4 formation.
41
Abstract: We report the electrical, structural and mechanical properties of grain boundaries (GBs) in multicrystalline Si (mc-Si) based on electron-beam-induced current (EBIC), transmission electron microscope (TEM), and scanning infrared polariscope (SIRP) characterizations. The recombination activities of GBs are clearly classified with respect to GB character and Fe contamination level. The decoration of Fe impurity at boundary has been approved by annular dark field (ADF) imaging in TEM. Finally, the distribution of residual strain around GBs, and the correlations between strain and electrical properties are discussed.
19
Abstract: The breakdown failure points in the 4H-SiC PiN diodes were analyzed by the electron beam induced current (EBIC). We focused on the failure, which showed the avalanche breakdown, and we determined the failure points by an emission microscopy. We observed the basal plane dislocation around the failure point and at measured temperatures below 200K we found the dark spots in the EBIC. However, in the X-ray topography image, no spots were found around the dislocations. We therefore think that these spots originated from the metal contamination. The electric field was multiplied due to a permittivity change, and this multiplication caused the avalanche breakdown.
707
Abstract: In this work, we observed and investigated electro-luminescence (EL) from defects in 4H-SiC avalanche photodiodes. The EL irradiance originated from parallel lines oriented along the [11-20] crystallographic direction. Optical microscopy imaging was employed to analyze the intensity distribution of luminescencing lines at different current densities. Electron beam induced current (EBIC) methodology was employed to find correlation between the luminescencing defects and dislocations in the epi-layers. TEM analysis of the substrate region having the brightest luminescencing line was performed. There were a few defects at the depth of about 3 μm from the sample surface where EL intensity had the highest value.
1211
Abstract: Calculation of relation between the EBIC contrast and the recombination strength for dislocations and quasi-two-dimensional dislocation trails has been carried out taking into account the real values of depletion region width. Using the relations obtained the linear defect density along dislocations and sheet density in dislocation trails are estimated. The results of EBIC investigations of dislocations and dislocation trails in plastically deformed n- and p-Si are analyzed.
529
Abstract: We have succeeded in imaging the leakage sites of hafnium silicate gate dielectrics of metal-oxide-semiconductor field-effect transistors (MOSFETs) by using electron-beam-induced current (EBIC) method. Leakage sites of p-channel MOSFETs were identified as bright spots under appropriate reverse bias condition when the electron beam energy is high enough to generate carriers in the silicon substrate. Most of the leakage sites were observed in the peripheries of shallow trench isolation. These results suggest that some process induced defects are the cause of leakage in these MOSFETs. Our observation demonstrates the advantage of EBIC characterization for failure analysis of high-k MOSFETs.
449
Abstract: Aim of this work is to study the electrical properties and the minority charge carrier recombination behaviour of extended defects in multicrystalline silicon (mc-Si) ingots grown from solar grade silicon (SoG-Si) feedstock. The pure metallurgical SoG-Si feedstock has been produced directly by carbothermic reduction of very pure quartz and carbon without subsequent purification processes.This mc SoG-Si is studied by temperature-dependent Electron Beam Induced Current measurements and PhotoLuminescence spectroscopy and the potentiality of the combination of these two techniques in the identification of the defects which limit the quality of the base material is shown. The EBIC mapping technique shows the presence of electrically active grain boundaries at room temperature while dislocations result inactive. Dislocations become active only at temperatures lower than 250K, indicating a moderate level of metal decoration. The most detrimental defects in this material seem to be the grain boundaries and impurities dissolved in the matrix. Furthermore, the PL spectra reveal the presence of oxygen and carbon related complexes. In this work we show that the knowledge about the defect related recombination processes acquired by a combined application of EBIC measurements and PL-spectroscopy is of particular importance to tune the proper solar cell process step to be applied on such material.
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