Papers by Keyword: Epitaxy

Abstract: Nitride materials are critical for a range of applications, including UV-visible light emitting diodes (LEDs). Advancing the performance, reliability and synthesis of AlGaN/GaN and InGaN/GaN heterojunction devices requires a systematic methodology enabling characterization of key metric like alloy composition, thickness and quality possibly in real time. This contribution reports on the real time characterization of the plasma assisted molecular beam epitaxy of AlGaN/GaN and InGaN/GaN heterostructures. Spectroscopic ellipsometry real time monitoring has revealed a number of key process and material iusses, such as the roughening of the GaN templates depending on plasma exposure during the substrate cleaning step, the composition of the alloy and the growth mode. Parameters like the plasma conditions, the surface temperature and the atomic flow ratio are investigated to understand the interplay process-material composition-structure-optical properties.

Abstract: The effects of several surfactants on the homoepitaxial and heteroepitaxial growth of metallic films and multilayers have been studied and compared. Our measurements clearly revealed that pre-deposition of a small amount of surfactant prior to the adatom deposition changed thin film growth mode and structure. The pre-deposited surfactant enhanced layer-by-layer (LBL) growth of the homoepitaxial and heteroepitaxial growth of metallic films. The surfactant also enhanced the epitaxial growth of metallic multilayer.

Abstract: Crystallographic quality of the epitaxial layers depends on the process temperature, partial pressures of active components and the surface polarity and also on the crystallographic quality of the subsurface layer resulting from the preparation of the substrate. The polishing etching in hydrogen-propane atmosphere of 4H-SiC substrate of different orientations and polarity was studied. The optimization of the polishing etching has been achieved with respect to the flow of C3H8, the duration and the temperature of the process. The investigation of the surface of SiC substrate before and after in situ polishing-etching in H2+C3H8 atmosphere was carried out by Nomarski interference contrast microscopy (DIC) and atomic force microscope (AFM).

Abstract: 4H Silicon Carbide (4H-SiC) has a great potential for low-loss power devices due to its superior electrical properties. However, the increase in demand for the power devices requires high quality SiC substrates and epitaxial layers. Mercury probe Capacitance Voltage (Hg CV) measurement is a well known procedure to characterize epi layers grown on SiC substrates, due to its non-destructive technique. However, careful calibration of the tool is very important for repeatable and accurate measurements. Here we present very close repeatability of Hg CV within 2.4% (standard deviation 0.7%), between different Solid State Measurements (SSM) setups compared with Ni Schottky (NiS) CV. In addition to growing uniformly doped epi layers, high surface quality of the epi layer is also needed for improved device performance. Improved process conditions resulted in a smooth epi with a surface roughness Ra 1.2 nm for a 6 µm thick epi layer. Molten Potassium Hydroxide (KOH) etching analysis also revealed a significant correlation between the surface roughness and epi defects.

Abstract: The so-called “growth” of graphene was performed using a horizontal chemical vapor deposition (CVD) hot-wall reactor. In-situ etching in the mixture (H2-C3H8) was performed prior to growth at 1600oC temperature under 100 mbar. Systematic studies of the influence of the decomposition temperature and time, substrates roughness, etching of the substrates, heating rate, SiC dezorientation and other process parameters on the graphene thickness and quality have been conducted. Morphology and atomic scale structure of graphene was examined by Scanning Tunnelling Microscopy (STM), Transmission Electron Microscopy (TEM) and Raman scattering methods.

Abstract: The initial stage of heteroepitaxial growth of 3C-SiC and homoepitaxial growth of 6H-SiC on nominal 6H-SiC on-axis substrates has been studied. Before 3C-SiC starts to nucleate, 6H-SiC grows in a step-flow growth mode due to a slight off-orientation of the substrate surface already at about 1500oC. In the 1650-1700oC temperature interval 3C-SiC nucleates as 2D islands. A distance away from the 3C-SiC island 6H-SiC grows in step-flow mechanism. In the vicinity of the 3C-SiC islands the 6H-SiC growth steps start to change direction and even split into two steps with the equal height of 0.5 nm, which is approaching the unit cell size of cubic SiC. When the supersaturation is lower in comparison with the conditions for 3C-SiC growth, there is only formation of 6H-SiC, i.e. homoepitaxial growth. The growth mode of 6H-SiC is dependent on temperature. At the lowest temperature there is spiral growth while at higher temperature 2D nucleation is preferred.

Abstract: Epitaxial layers were grown on 4° off-axis 4H-SiC substrates by hot-wall chemical vapor deposition. The reduced off-cut angle resulted in lower basal plane dislocation (BPD) densities. The dependence of BPD reduction on growth conditions was investigated using ultraviolet photoluminescence (UVPL) imaging. With this method, it was found that the dislocations were converting to threading edge dislocations throughout the thickness of the film. A high (≥ 97%) conversion efficiency was found for all films grown with this orientation. A conversion of 100% was achieved for several films without pre-growth treatments or growth interrupts.

Abstract: A method to improve the uniformity of epitaxial wafers grown in planetary rotation reactors through analysis of intentionally stalled wafer measurements is described. A set of basis functions that are completely uniform when rotated in the reactor environment are described and used to construct a nearest uniformity producing profile (NUPP). The methodology for use of stalled wafer profiles and comparison to the NUUP allows easy identification of the changes in process parameters necessary for more uniform epitaxial growth. Although described here as applied to SiC epitaxial growth, this method is applicable to all planetary rotation reactors which are utilized for SiC and III-V semiconductor epitaxial growth.

Abstract: There is a great need for an in-line, high-speed and non-destructive inspection system capable of evaluating and analyzing the quality of SiC wafers for SiC power devices. We have examined whether the laser-based optical non-destructive inspection system by KLA-Tencor meets these requirements. Using this system, incoming inspection of purchased SiC wafers has been performed. The obtained inspection data show that micropipe density is sufficiently low in a device-grade wafer, and therefore, micropipes are not the main cause of device failure. The next challenges for a device-grade SiC wafer are reduction of epitaxial defects and relatively small defects classified as “particles”.

Abstract: Slip of basal plane dislocations in 4H-SiC epitaxy is observed by synchrotron reflection X-ray topography. It is verified that average slip distance and slip thickness increase with decreasing donor concentration of epilayer. Since N atom, which is incorporated at carbon site in 4H-SiC and acts as a donor, has a smaller radius than that of C atom, lattice contraction effect is expected due to incorporation of N. Considering difference of lattice contraction between the substrate and the epilayer owing to difference of donor concentration, strain in the epilayer is estimated. The strain is expected to increase with decreasing the donor concentration of epilayer and the results are explained from this point of view.