Papers by Keyword: IC Package

Abstract: An experimental facility is built up to investigate the abrasive wear behavior of EMC particles. The parameters explored include particle impacting velocity and impacting angle. The results show that the erosion rate depends on both the particle impacting velocity and impacting angle. A higher velocity will cause more erosion whereas a smaller impacting angle will cause more erosion, especially at higher impacting velocities. Furthermore, the morphology of the eroded particles is irregular in shape and a smaller impacting angle will result in a larger dimension of the eroded particles.

Abstract: Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A major cause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, and Poisson’s ratios of the package materials. Here, the influence of delamination between epoxy and dielectric layers on pattern shift and passivation cracking in IC package under aeronautical conditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximum principal stresses theory using a certain 2D FEM model with different delamination length “L_c.right”. Delaminations are easy to introduce more dangerous impact to the package, because the IC microstructures endure serious thermo-mechanical loading under aeronautical working conditions. The method can be used to find the dangerous designed structure schedules and will provide a basis for selecting passivation materials of aeronautical IC packages.

Abstract: Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.