Papers by Keyword: MFIS Structure

Abstract: Y0.5Yb0.5MnO3 ferroelectrics/HfO2 stacking layers were successfully constructed on Si(100) substrates through the chemical solution deposition. The degree of c-axis orientation and microstructure of Y0.5Yb0.5MnO3 ferroelectrics was improved by the control of concentration of precursor solutions. Capacitance of Pt/Y0.5Yb0.5MnO3/HfO2/Si structure was almost constant over 104 s on the retention property.

Abstract: Pt/PZT/PbO/Si with the MFIS structure was deposited on the p-type (100) Si substrate by the r.f. magnetron sputtering method with Pb1.1Zr0.53Ti0.47O3 and PbO targets. From the X-ray photoelectron spectroscopy (XPS) results, we could confirm that the partial pressure ratio during PbO deposition affects the interface condition of PbO/Si and the chemical state of Pb existing at the surface of the PZT thin film. The maximum value of the memory window is 3.0 V under the applied voltage of 9V for Pt/PZT (200 nm 400°C)/PbO (80 nm, 300°C)/Si structures with the PbO buffer layer deposited at the partial pressure of 7:3. From these results, we could assume that the PbO buffer layers play a role of the diffusion barrier between the PZT thin film and the Si substrate as well as the seed layer.

Abstract: The Y0.5Yb0.5MnO3 ferroelectrics/HfO2 stacking layer was constructed on Si(100) substrate through the chemical solution deposition. The HfO2 insulating layer crystallized on Si(100) substrates consisted of uniform grains and had smooth surface. The Y0.5Yb0.5MnO3 film prepared on the HfO2 insulator layer had preferred orientation along c-axis. The Y0.5Yb0.5MnO3 film consisted of uniform grains and had smooth surface. The clockwise C-V hysteresis induced by ferroelectric polarization switching was observed in the MFIS structure. The memory window of the MFIS structure was about 2 V and the retention time was over 105 s.

Abstract: ZrO2 buffer layer and SrBi2Ta2O9 (SBT) thin films were deposited on the P-type Si(111) substrates by the R.F. magnetron-sputtering method. We studied the effect of the post-annealing of the ZrO2 buffer layer on the MFIS structure. We could conclude that the elements of Zr, Sr, Bi, and Ta etc. were diffused by the post-annealing, and according to the process with and without the post-annealing of the ZrO2 layer, the diffusion amount of Sr, Bi, Ta elements shows slight difference through the glow discharge spectrometer (GDS) analysis. From the results of the XPS analysis, we can confirm that a small amount of SiO2 and metallic Zr exist at the interface, and ZrO2 exists as the amorphous state with the weak binding energy before the post-annealing process. Contrarily, after the post-annealing of the ZrO2/Si structure, SiO2 and metallic Zr are observed at the wide range, but the bonding state of ZrO2 is strengthened.

Abstract: The (Y,Yb)MnO3 films were crystallized on Y2O3 layers using alkoxy-derived precursor solutions. As a result of investigation of the effect of the Y2O3 layer on the dielectric properties of the (Y,Yb)MnO3/Y2O3/Si, the crystallographic properties such as the orientation and surface morphology of the (Y,Yb)MnO3 thin films depended on the crystallographic appearance of the insulator layer. Following that, the dielectric properties of the MFIS structures varied. For the construction of excellent MFIS structure, the improvement of the orientation, crystallinity, and surface smoothness of the (Y,Yb)MnO3 film by the optimization of the microstructure and dielectric property of the insulator is necessary.

Abstract: The MFS and MFIS structures were prepared on the Si and PbO/Si substrate by the r.f. magnetron sputtering method. When the PbO buffer layer was inserted between the PZT thin film and Si substrate, the crystallization of the PZT thin films was considerably improved, and the processing temperature was lowered. Compared with the MFS structure, memory window values of the MFIS structure with the buffer layer were considerably improved. In particular, in the MFIS structure, the maximum value of the memory window is 2.0 V under the applied voltage of 9V for Pt/PZT (200 nm, 400ı)/PbO (80 nm)/Si structures with the PbO buffer layer deposited at the substrate temperature of 300ı.