Papers by Keyword: Oxygen Precipitation

Abstract: Oxygen precipitation (OP) behaviors in conventional and nitrogen co-doped heavily arsenic-doped Czocharalski silicon crystals subjected to low-high two-step anneals of 650 oC/8 h + 1000 oC/4-256 h have been comparatively investigated. Due to the nitrogen enhanced nucleation of OP during the low temperature anneal, much higher density of oxygen precipitates generated in the nitrogen co-doped specimens. With the extension of high temperature anneal, Oswald ripening of OP in the nitrogen co-doped specimens preceded that in the conventional ones. Moreover, due to the Oswald ripening effect, the oxygen precipitates in the conventional specimens became larger with a wider range of sizes. While, the sizes of oxygen precipitates in the nitrogen co-doped specimens distributed in a much narrower range with respect to the conventional ones.

Abstract: The results of highly sensitive FTIR investigation, ab initio calculations and rate equation modeling of the early stages of oxide precipitation are compared. The attachment of interstitial oxygen to VOn is energetically more favorable than the attachment to On for n  6. For higher n the energy gain is comparable. The point defect species which were detected by highly sensitive FTIR in high oxygen Czochralski silicon wafers are O1, O2, O3, and VO4. Rate equation modeling for I, V, On and VOn with n = (1..4) also yields O1, O2, O3 to appear with decreasing concentration and VO4 as that one of the VOn species which would appear in the highest concentration after RTA.

Abstract: The use of Rapid Thermal Processing to install lattice vacancy profiles into silicon wafers for the purpose of forming a template for the nucleation and ideal control of oxygen precipitation has become an important materials engineering tool for the microelectronics industry. This paper reviews the principles of the technique and the precise materials/defect engineering that it engenders. It furthermore discusses what has been learned regarding the elusive properties of the intrinsic point defects in silicon through studies of the distributions of vacancies created by use of the technique. Also discussed are recent discoveries about the critical role of the other intrinsic point defect, the self-interstitial and the development of oxygen precipitates and their distributions post-nucleation and the critical importance of what has become to be called the “ninja transformation” in the switching-on of gettering efficiency of oxygen precipitate systems.

Abstract: Oxygen precipitation in Si is a complex set of processes which has been studied over many years. Here we review theoretical work relating to the precipitation process. At temperatures around 450°C oxygen atoms become mobile and form a family of thermal double donors. The structure of these defects and the origin of their electrical activity is discussed. At temperature around 650°C these donors disappear and there is a growth of SiO2 precipitates along with rod like defects which are extended defects involving Si interstitials. At higher temperatures these collapse into dislocation loops. The structure and electrical properties of the rod like defect are described and compared with those of dislocations.

Abstract: This paper aims at reviewing the possibilities of using p-n junction diodes for lifetime and defect analysis in semiconductor materials. In a first part, the theoretical basis of lifetime extraction based on p-n junction current-voltage and capacitance-voltage characteristics will be discussed. In the next parts, these methods will be applied to different cases relevant for advanced semiconductor materials and device processing. First, the impact of the initial interstitial oxygen content and thermal pre-treatment of Czochralski silicon substrates on the carrier generation and recombination lifetime is discussed. A comparison will also be made with epitaxial and Float-Zone silicon. In a next part, the impact of proton-irradiation damage on the diode behavior will be presented. In the final part, the application of the technique on SiGe and Ge based p-n junctions is described. Whenever possible and useful, the information extracted from p-n junction characteristics will be compared with direct lifetime measurements using microwave techniques. Additional defect information has also been gained from other well-known techniques like Deep- Level Transient Spectroscopy (DLTS), Electron-Beam-Induced Current (EBIC), etc and will be correlated with the p-n junction results. The review is wrapped up in a summary followed by an outlook on future evolution and requirements.

Abstract: The content of interstitially solved oxygen (Oi) in heavily boron doped silicon (9- 29 m
cm) were measured by low temperature Fourier transform infrared (FTIR) spectroscopy. Therefor an alternative thinning technique for silicon is used: by alkaline potassium hydroxide etching (KOH) prepolished silicon specimens are thinned down to 8 - 60 microns. The optimal end thickness depends on the boron concentration which specifies the free carrier concentration. Specimens with three different boron concentrations (9/19/29 m
cm) were examined. The results are compared with gas fusion analysis (GFA) measurements. Furthermore the precipitated oxygen Oi was measured for a RTA process (20s@1250°C) with subsequent growth steps (4h@780°C + 16h@1000°C).

Abstract: The electrical activity of stacking faults (SFs) in multicrystalline sheet silicon has been examined by correlating EBIC(electron beam induced current), preferential defect etching, and microwave photo-conductance decay (PCD) lifetime measurements. Following a three hour 1060 0C annealing the interstitial oxygen concentration decreased from 14 to 4.5 x 1017 cm-3, during which time a high density of SFs were generated in the center of individual large grains. Subsequent EBIC contrast variation within individual large grains was correlated with the local SF density revealed by preferential etching. In addition, a more quantitative intra-grain lifetime was obtained from high spatial resolution PCD measurements. It was found that an SF density of 1 to 2 x 106 cm-2 produces a lifetime limitation in sheet silicon which corresponds to a recombination lifetime of ~2 µs.

Abstract: Theoretical consideration for technologically important phenomena in defect engineering of Czochralski silicon was performed with first principles calculation. (i) Point defect behaviour during crystal growth, (ii) enhanced oxygen precipitation in p/p+ epitaxial wafers, and (iii) Cu gettering by impurities are main topics in this work. Following results are obtained. (i) Interstitial Si I is dominant in p type Si while vacancy V is dominant in n type Si during crystal growth when dopant concentration is higher than about 1x1019atoms/cm3. (ii) In initial stage of oxygen precipitation including a few interstitial oxygen (O) atoms, BOn complex is more stable than On complex. The diffusion barrier of O atom in p+ Si is reduced to about 2.2eV compared with the barrier of about 2.5eV in intrinsic Si. (iii) In substitutional B, Sb, As, P and C atoms, only B atom can be an effective gettering center for Cu.

Abstract: Oxygen precipitation and creation of defects in Czochralski grown silicon with interstitial oxygen concentration 9.4·1017 cm-3, subjected to irradiation with neutrons (5 MeV, dose 1x1017 cm-2) and subsequently treated for 5 h under atmospheric and high hydrostatic pressures (HP, up to 1.1 GPa) at 1270 / 1400 K, were investigated by spectroscopic and X - Ray methods. Point defects created by neutron irradiation stimulate oxygen precipitation and creation of dislocations under HP, especially at 1270 K. The effect of pressure treatment is related to changed concentration and mobility of silicon interstitials and vacancies as well as of the VnOm – type defects.