Papers by Keyword: Surface Polarity

Abstract: Vanadium doped semi-insulating (SI) 6H-SiC {0001} substrates and their wetting properties were characterized using precisely dispensed de-ionized (DI) water drops. Radius, contact angle, width (chord), height and cap volume of a DI water drop on the SiC surface were quantitatively determined by analyzing sideview images of DI water drop in contact with SI 6H-SiC {0001} substrates using image processing software. The average of ten (10) contact angle measurements showed approximately 4 ° difference between the Si-face (48.48°) and the C-face (44.33º). Contact angle on the Si-face (0001) measured after native oxide removal showed significant decrease of contact angle, from 55° to 25° and recovered over time by room temperature oxidation in air. In contrast, contact angle on the C-face (000-1), measured after native oxide removal, showed significant increase of contact angle, from 40° to 54°, and continue to increase contact angle up to 71° after room temperature oxidation for 24 hours in air. Contact angle is found to be very sensitive to SiC surface polarity and specific surface conditions. Contact angle measurement, using image analysis techniques, can be applied as an in-line identification and surface condition characterization technique for SiC polytypes of specific surface polarities.

Abstract: Wet chemical etching using molten KOH is the most frequently applied method to reveal structural defects in SiC. Until now etching kinetics of SiC in planes different from the polar cplane has not been reported. In this paper we report on defect etching of SiC in non-polar faces. Using a calibrated KOH defect-etching furnace with possibilities to set accurate etching temperatures we have etched SiC samples of various orientations to (i) study defect occurrence and their morphologies (ii) set KOH defect etching parameters for SiC for these orientations and (iii) investigate etching kinetics in relation to anisotropy/surface polarity. For non-polar planes of the same orientations a comparison in etching kinetics and defect morphologies in crystals grown in different directions is presented.

Abstract: Raman spectroscopy using deep UV (DUV) light excitation has been applied to characterizing process-induced defects in surface layers in SiC. Raman spectra of P+-ion implanted and post annealed SiC have been measured as a function of dose level and annealing temperature. The recovery of the crystallinity and electrical activity have been evaluated. Precipitation of excess phosphorus was found in heavily doped specimens. High dose implanted and post annealed samples show uneven distribution of residual defects, which is demonstrated by mapping of Raman bandwidth. Damage in 4H-SiC surfaces, which were mechanically polished with various sizes of abrasives, has been evaluated from DUV micro-Raman measurements. The Raman analysis demonstrates that bandwidth and peak frequency can be used as monitors of the polish–induced damage. It is found that localized defects reducing free carrier density remain even after polishing with small sized abrasives.