Papers by Keyword: Triangular Defects

Abstract: Homoepitaxial layers with very good thickness and doping uniformity were grown on 4 inch 4˚ off-axis substrates in a 10x100mm planetary reactor. Process optimizations resulted in reduction of the size of the triangular defects. Aggressive pre-etching of the substrate prior to growth resulted in further suppression of the triangular defect concentration from 3-5cm^-2 to 0.5cm^-2 using the same growth processes. Even imperfect areas of the substrate with scratches show suppressed nucleation of triangular defects. JBS diodes with triangular defects show increased leakage depending on the size of the defects. This effect is more pronounced at higher voltages.

Abstract: Dislocations were investigated in the halo-carbon low-temperature epitaxial growth and low-temperature selective epitaxial growth (LTSEG) conducted at 13000C. The origin of triangular defects was investigated in low-temperature epilayers grown at higher growth rates with HCl addition. Due to the conversion of substrates’ basal plane dislocations (BPD) into threading dislocations, the concentration of BPDs was about an order of magnitude lower than the concentration of threading dislocations at moderate growth rates. An additional order of magnitude conversion of BPDs into threading dislocations was observed at higher grow rates achieved with HCl addition. In LTSEG epilayers, dislocation concentration away from the mesa walls was comparable to the blanket (i.e., regular non-selective) growth. High concentrations of BPDs were found only at mesa edges located on the “upstream” side with respect to the step-flow direction. No substrate defects could be traced to the triangular defects. Instead, the disturbances causing the triangular defect generation are introduced during the epitaxial process.

Abstract: CVD growth of epitaxial layers with a mirror like surface grown on 75 mm diameter 4° off-axis 4H SiC substrates is demonstrated. The effect of the C/Si ratio, temperature and temperature ramp up conditions is studied in detail. A low C/Si ratio of 0.4 and a temperature of 1530 °C is the best combination to avoid step bunching and triangular defects on the epitaxial layers. Using a low growth rate (about 3 µm/h) 6 μm thick, n-type doped epilayers were grown on 75 mm diameter wafers resulting in an RMS value of 0.7 nm and good reproducibility. 20 μm thick epitaxial layers with a background doping in the low 1014 cm-3 were grown with a mirror-like, defect-free surface. Preliminary results when using higher Si/H2 ratio (up to 0.4 %) and HCl addition are also presented: growth rate of 28 μm/h is achieved while keeping a smooth morphology.

Abstract: Triangular defects and inverted pyramid type defects formed during homoepitaxial growth on 4H-SiC Si face, 4° off-cut towards [11-20] direction have been investigated. Growth parameters responsible for triangular defect formation were identified and optimized for its reduction in this study. It was found that although the high temperature reduces the density of inverted pyramid type defects, it is not the only remedy for reducing their density and cleanliness of susceptor along with the initial growth condition plays a major role in the formation of these defects.