Papers by Keyword: VJFET

Abstract: Results are presented for the silicon carbide (SiC) vertical channel junction field effect transistor (VJFET) fabricated based on in-house SiC epitaxial wafer suitable for power devices. We have demonstrated continuous improvement in blocking voltage, forward drain current under high temperature. The SiC VJFET device’s current density is 360 A/cm² and current is 11 A at V_G= 3 V and V_D = 2 V, with related specific on-resistance 5.5 mΩ·cm². The device exceeds 1200 V at gate bias V_G = -10V. The current of the SiC VJFET device is 4 A and the reverse voltage is 1200V at the 200 °C high temperature.

Abstract: Simulation, Fabrication and characteristics of high voltage, normally-off JFETs in 4H-SiC are presented. The devices were built on ND= 1.01015 cm-3 doped 50μm thick n-type epilayer grown on a n+ 4H-SiC. Parameters of edge termination have been optimized by simulations. Its blocking voltage exceeds 4500V at gate bias VG = -6V and forward drain current is in excess of 3A at gate bias VG = 3V and drain bias VD = 5V corresponding a current density of 80A/cm2.

Abstract: A silicon carbide (SiC) vertical channel junction field effect transistor (VJFET) was fabricated based on in-house SiC epitaxial wafer with lift-off trenched and implanted method. Its blocking voltage exceeds 1300V at gate bias VG = -6V and forward drain current is in excess of 5A at gate bias VG = 3V and drain bias VD = 3V. The SiC VJFET device’s current density is 240A/cm2 at VG= 3V and VD = 3V, with related specific on-resistance 8.9mΩ•cm2. Further analysis reveals that the on-resistance depends greatly on ohmic contact resistance and the bonding spun gold. The specific on-resistance can be further reduced by improving the doping concentration of SiC channel epilayer and the device’s ohmic contact.

Abstract: In this paper, we describe the design of a high voltage SiC VJFET monolithically integrated with a JBS diode. The integrated device that was demonstrated up to 834 V in forward blocking doesn’t add any steps to the VJFET fabrication process. While the diode and VJFET share the same surface field termination mechanism, they are partially isolated using implanted field rings. We describe TCAD based optimization of the dimensions of these field rings and outline the design of the JBS diode using a fully analytical 2-D model.

Abstract: A 4.1x4.1mm2, 100mΩ 1,2kV lateral channel vertical junction field effect transistor (LCVJFET) built in silicon carbide (SiC) from SiCED, to use as the active switch component in a high-temperature operation DC/DC-boost converter, has been investigated. The switching loss for room temperature (RT) and on-state resistance (Ron) for RT up to 170°C is investigated. Since the SiC VJFET has a buried body diode it is also ideal to use instead of a switch and diode setup. The voltage drop over the body diode decreases slightly with a higher temperature. A short-circuit test has also been conducted, which shows a high ruggedness.

Abstract: Trenched implanted vertical JFETs (TI-VJFETs) with self-aligned gate and source contacts were fabricated on commercial 4H-SiC epitaxial wafers. Gate regions were formed by aluminium implantation through the same silicon oxide mask which was used for etching mesa-structures. Self-aligned nickel silicide source and gate contacts were formed using a silicon oxide spacer formed on mesa-structure sidewalls by anisotropic thermal oxidation of silicon carbide followed by anisotropic reactive ion etching of oxide. Fabricated normally-on 4H-SiC TI-VJFETs demonstrated low gate leakage currents and blocking voltages exceeding 200 V.

Abstract: An optically controlled power switch based on 4H-SiC Trenched and Implanted Vertical JFETs (TIVJFET) was developed that comprises three parts: an LED light-source driver, light-triggered integrated gate buffer driver, and vertical high power normally-off switch. The light-triggered integrated gate buffer driver includes a photodiode and four stages of low voltage 4H-SiC TIVJFETs, which are hybrid integrated. Optically gated power switching was experimentally demonstrated with a maximum switching frequency of about 50 kHz, the system performance limiting factors were clearly identified and experimentally confirmed, and ways to substantially increase the switching frequency were shown. From calculations, based on realistically possible system parameters values, it could be seen that a maximum switching frequency around 1 MHz is theoretically possible with a proper choice of light source, detector, and buffer transistor parameters.

Abstract: This work presents the progress in developing an all SiC based power module for use in high frequency and high efficiency applications. Using parallel combinations of 1200V enhancement mode SiC VJFETs (36mm2) and Schottky diodes (23mm2), a total on-resistance of only 10mOhm (2.7m-cm2) was achieved at ID=100A in a commercially available standard module configured as a half-bridge circuit. Careful attention to module layout, gate driver design, and the addition of optimized snubbers resulted in excellent switching waveforms with low total switching losses of 1.25mJ when switching 100A at 150oC.

Abstract: Prototype 800 V, 47 A enhancement-mode SiC VJFETs have been developed for high temperature operation (250 °C). With an active area of 23 mm2 and target threshold voltage of +1.25 V, these devices exhibited a 28 m room temperature on-resistance and excellent blocking characteristics at elevated temperature. With improved device packaging, on-resistance and saturation current values of 15 m and 100 A, respectively, are achievable.

Abstract: Trenched and implanted vertical JFETs (TI-VJFETs) with blocking voltages of 700 V were fabricated on commercial 4H-SiC epitaxial wafers. Vertical p+-n junctions were formed by aluminium implantation in sidewalls of strip-like mesa structures. Normally-on 4H-SiC TI-VJFETs had specific on-state resistance (RO-S ) of 8 mW×cm2 measured at room temperature. These devices operated reversibly at a current density of 100 A/cm2 whilst placed on a hot stage at temperature of 500 °C and without any protective atmosphere. The change of RO-S with temperature rising from 20 to 500 °C followed a power law (~ T 2.4) which is close to the temperature dependence of electron mobility in 4H-SiC.