HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by keyword: «Wire Saw»

• Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon
  Published in: Application of Diamond and Related Materials (p72)
• Comparison of Different Diamond Coatings in Co-Based Bond Matrix for Wire Saws
  Published in: Advances in Materials Manufacturing Science and Technology II (p385)
• Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon
  Published in: Machining and Advanced Manufacturing Technology X (p265)
• Experimental Investigation on Cutting Aluminum Alloy Thick Plate with Brazed Diamond Wire Saw
  Published in: Advanced Materials and Manufacturing Technology I (p218)
• Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing
  Published in: Advances in Grinding and Abrasive Technology XV (p306)
• Manufacturing of Fixed-Abrasive Polyethylene Wire Saw
  Published in: Frontiers of Manufacturing and Design Science II (p1595)
• Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal
  Published in: Advances in Engineering Design and Optimization II (p950)
• Researching and Manufacturing of Endless Diamond Wire Saws and the Cutting Experiment
  Published in: Advances in Grinding and Abrasive Technology XIV (p445)
• Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon
  Published in: Advances in Grinding and Abrasive Technology XIV (p450)
• The Force Theoretical Analysis and Experiment for Wire Saw with UVM Cutting SiC Monocrystal
  Published in: Materials and Computational Mechanics (p1728)