Experimental Study of Kick up Phenomenon in Thermosonic Wire-Bonding

Jing Jing Tian; Lei Han

doi:10.4028/www.scientific.net/AMM.160.77

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 160Experimental Study of Kick up Phenomenon in...

Experimental Study of Kick up Phenomenon in Thermosonic Wire-Bonding

Abstract:

Kick-up phenomenon during looping is an important factor in thermosonic wire bonding. In this study, the loping process during wire bonding was recorded by using high-speed camera, and wire profiles evolution was obtained from images sequence by image processing method. With a polynomial fitting, the wire loop profiling was described by the curvature changing, and kick-up phenomenon on gold wire was found between the instant of 290th frame(0.0537s) to 380th frame (0.0703s), the change of curvature is divided into three phases, a looping phase, a mutation phase and a kick-up phase. While in the kick-up phase, the kick up phenomenon is the most obvious. These experimental results were useful for in-depth study of kick-up phenomenon by simulation.

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Periodical:

Applied Mechanics and Materials (Volume 160)

Pages:

77-81

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.160.77

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Online since:

March 2012

Authors:

Jing Jing Tian, Lei Han

Keywords:

Curvature, High Speed Video Camera, Kick-Up, Polynomial Fitting, Wire Looping

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